Inventor · disambiguated record
Ronald K. Haines
Also filed as: HAINES RONALD K
11 granted patents·258 citations·filing 1994–1999
92Inventor score
Top patents by PatentIndex Score
11 records- 0189US5458746AProcess for making copper metal powder, copper oxides and copper foilMAGMA COPPER CO·Filed 1994·Granted Oct 17, 1995·60 cites·37 claims
- 0286US5908542AMetal foil with improved bonding to substrates and method for making the foilGOULD ELECTRONICS INC·Filed 1997·Granted Jun 1, 1999·58 cites·24 claims
- 0379US5685970AMethod and apparatus for sequentially metalized polymeric films and products made therebyGOULD ELECTRONICS INC·Filed 1995·Granted Nov 11, 1997·25 cites·5 claims
- 0477US6036839ALow density high surface area copper powder and electrodeposition process for making sameELECTROCOPPER PROD LTD·Filed 1998·Granted Mar 14, 2000·32 cites·19 claims
- 0570US5670033AProcess for making copper metal powder, copper oxides and copper foilELECTROCOPPER PROD LTD·Filed 1995·Granted Sep 23, 1997·26 cites·31 claims
- 0669US5681443AMethod for forming printed circuitsGOULD ELECTRONICS INC·Filed 1996·Granted Oct 28, 1997·22 cites·10 claims
- 0756US6322609B1Low density high surface area copper powder and electrodeposition process for making sameFiled 1999·Granted Nov 27, 2001·11 cites·28 claims
- 0855US5520792AProcess for making copper metal powder, copper oxides and copper foilELECTROCOPPER PROD LTD·Filed 1995·Granted May 28, 1996·11 cites·10 claims
- 0944US5716502AMethod and apparatus for sequentially metalizing polymeric films and products made therebyGOULD ELECTRONICS INC·Filed 1996·Granted Feb 10, 1998·4 cites·18 claims
- 1040US5944965AMethod and apparatus for sequentially metalizing polymeric films and products made therebyGOULD ELECTRONICS INC·Filed 1997·Granted Aug 31, 1999·5 cites·11 claims
- 1137US6224722B1Method and apparatus for sequentially metalizing polymeric films and products made therebyGOULD ELECTRONICS INC·Filed 1999·Granted May 1, 2001·4 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →