Inventor · disambiguated record
Robert Steven Hannebauer
Also filed as: HANNEBAUER ROBERT · HANNEBAUER ROBERT S · HANNEBAUER ROBERT STEVEN
24 granted patents·6 pending applications·355 citations·filing 1987–2025
95Inventor score
Top patents by PatentIndex Score
30 records- 0198US11716114B2Encoder and decoder circuits for the transmission of video media using spread spectrum direct sequence modulationhyPHY USA Inc·Filed 2022·Granted Aug 1, 2023·13 cites·22 claims
- 0296US11463125B2Transporting sampled signals over multiple electromagnetic pathwayshyPHY USA Inc·Filed 2018·Granted Oct 4, 2022·16 cites·28 claims
- 0395US6841816B2Vertical color filter sensor group with non-sensor filter and method for fabricating such a sensor groupFOVEON INC·Filed 2003·Granted Jan 11, 2005·103 cites·99 claims
- 0494US7723686B2Image sensor for detecting wide spectrum and method of manufacturing the sameHANVISION CO LTD·Filed 2008·Granted May 25, 2010·53 cites·16 claims
- 0592US12368467B2Transporting sampled analog signals over multiple electromagnetic pathwayshyPHY USA Inc·Filed 2023·Granted Jul 22, 2025·1 cites·24 claims
- 0692US6794627B2Aggregation of active pixel sensor signalsFOVEON INC·Filed 2001·Granted Sep 21, 2004·56 cites·35 claims
- 0788US11894869B2Transporting sampled signals over multiple electromagnetic pathwayshyPHY USA Inc·Filed 2022·Granted Feb 6, 2024·1 cites·20 claims
- 0888US6960757B2Simplified wiring schemes for vertical color filter pixel sensorsFOVEON INC·Filed 2003·Granted Nov 1, 2005·48 cites·19 claims
- 0985US7977145B2Method of fabricating silicon/dielectric multi-layer semiconductor structures using layer transfer technology and also a three-dimensional multi-layer semiconductor device and stacked layer type image sensor using the same method, and a method of manufacturing a three-dimensional multi-layer semiconductor device and the stack type image sensorLUMIENSE PHOTONICS INC·Filed 2008·Granted Jul 12, 2011·10 cites·10 claims
- 1084US2025330210A1Transporting sampled signals over multiple electromagnetic pathwayshyPHY USA Inc·Filed 2025·Application pending·0 cites
- 1181US12021072B2Method of manufacturing of advanced three-dimensional semiconductor structures and structures produced therefromLUMIENSE PHOTONICS INC·Filed 2019·Granted Jun 25, 2024·3 cites·23 claims
- 1280US7977718B2Image sensor photodiodes using a multi-layer substrate and contact method and structure thereofLUMIENSE PHOTONICS INC·Filed 2010·Granted Jul 12, 2011·4 cites·5 claims
- 1371US12047112B2Decoder circuits for the transmission of video media using spread spectrum direct sequence modulationhyPHY USA Inc·Filed 2023·Granted Jul 23, 2024·0 cites·17 claims
- 1471US8039797B2Semiconductor for sensing infrared radiation and method thereofHAN VISION CO LTD·Filed 2008·Granted Oct 18, 2011·4 cites·7 claims
- 1571US7943409B2Method of fabricating image sensor photodiodes using a multi-layer substrate and contact method and the structure thereofLUMIENSE PHOTONICS INC·Filed 2010·Granted May 17, 2011·2 cites·2 claims
- 1671US6937025B1Method and circuit employing current sensing to read a sensorFOVEON INC·Filed 2003·Granted Aug 30, 2005·15 cites·15 claims
- 1770US7838318B2Method of fabricating image sensor photodiodes using a multi-layer substrate and contact method and the structure thereofLUMIENSE PHOTONICS INC·Filed 2008·Granted Nov 23, 2010·3 cites·2 claims
- 1869US2025158652A1Decoder circuits for the transmission of video media using spread spectrum direct sequence modulationhyPHY USA Inc·Filed 2024·Application pending·0 cites
- 1968US7796172B1Method and apparatus for eliminating image artifacts due to defective imager columns and rowsFOVEON INC·Filed 2004·Granted Sep 14, 2010·9 cites·18 claims
- 2061US8183079B2Semiconductor device and method of manufacturing the sameHANNEBAUER ROBERT·Filed 2011·Granted May 22, 2012·0 cites·8 claims
- 2159US8063370B2Semiconductor device and method of manufacturing the sameHANNEBAUER ROBERT·Filed 2009·Granted Nov 22, 2011·0 cites·16 claims
- 2256US11997415B2Sampled analog storage systemhyPHY USA Inc·Filed 2022·Granted May 28, 2024·0 cites·43 claims
- 2350US2023223981A1Wireless transmission of samples encoded using spread spectrum video transporthyPHY USA Inc·Filed 2023·Application pending·0 cites
- 2443US2021011166A1System, apparatus, and method for improving performance of imaging lidar systemsMETRIO SENSORS INC·Filed 2019·Application pending·0 cites
- 2543US2024281187A1Video transport within a mobile devicehyPHY USA Inc·Filed 2024·Application pending·0 cites
- 2641US8847160B2Semiconductor for sensing infrared radiation and method thereofHANNEBAUER ROBERT·Filed 2011·Granted Sep 30, 2014·0 cites·5 claims
- 2739US8232127B2Thermo-electric semiconductor device and method for manufacturing the sameHANNEBAUER ROBERT·Filed 2010·Granted Jul 31, 2012·0 cites·5 claims
- 2833US2010072461A1Thermo-electric semiconductor device and method for manufacturing the sameHANVISION CO LTD·Filed 2008·Application pending·0 cites
- 2931US5841807ASpread spectrum data communicatorINTRACOASTAL SYSTEM ENGINEERIN·Filed 1996·Granted Nov 24, 1998·12 cites·17 claims
- 3025US4845496AElectro-optical displacement sensorDOWER ROGER G·Filed 1987·Granted Jul 4, 1989·2 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →