Inventor · disambiguated record
Ronald L. Imken
Also filed as: IMKEN RONALD L · IMKEN RONALD LANN
15 granted patents·2 pending applications·916 citations·filing 1989–2011
95Inventor score
Top patents by PatentIndex Score
17 records- 0194US5229916AChip edge interconnect overlay elementIBM·Filed 1992·Granted Jul 20, 1993·162 cites·15 claims
- 0291US5509200AMethod of making laminar stackable circuit board structureIBM·Filed 1994·Granted Apr 23, 1996·145 cites·10 claims
- 0391US5065227AIntegrated circuit packaging using flexible substrateIBM·Filed 1990·Granted Nov 12, 1991·111 cites·13 claims
- 0490US5037311AHigh density interconnect stripIBM·Filed 1989·Granted Aug 6, 1991·61 cites·5 claims
- 0589US6098282ALaminar stackable circuit board structure with capacitorIBM·Filed 1998·Granted Aug 8, 2000·101 cites·7 claims
- 0688US5745333ALaminar stackable circuit board structure with capacitorIBM·Filed 1994·Granted Apr 28, 1998·90 cites·17 claims
- 0783US5316787AMethod for manufacturing electrically isolated polyimide coated vias in a flexible substrateIBM·Filed 1992·Granted May 31, 1994·65 cites·8 claims
- 0882US6489042B2Photoimageable dielectric material for circuit protection3M INNOVATIVE PROPERTIES CO·Filed 2001·Granted Dec 3, 2002·33 cites·21 claims
- 0979US5198693AAperture formation in aluminum circuit card for enhanced thermal dissipationIBM·Filed 1992·Granted Mar 30, 1993·63 cites·6 claims
- 1073US7871150B2Flexible circuits having ink-resistant covercoats3M INNOVATIVE PROPERTIES CO·Filed 2007·Granted Jan 18, 2011·3 cites·22 claims
- 1168US5146674AManufacturing process of a high density substrate designIBM·Filed 1991·Granted Sep 15, 1992·40 cites·17 claims
- 1265US5363275AModular component computer systemIBM·Filed 1993·Granted Nov 8, 1994·33 cites·21 claims
- 1350US7947429B2Long length flexible circuits and method of making same3M INNOVATIVE PROPERTIES CO·Filed 2007·Granted May 24, 2011·0 cites·13 claims
- 1444US2007165075A1Flexible circuits having ink-resistant covercoats3M INNOVATIVE PROPERTIES CO·Filed 2006·Application pending·0 cites
- 1543US4943242AZero insertion force high density connector systemIBM·Filed 1989·Granted Jul 24, 1990·9 cites·24 claims
- 1642US2011284268A1Flexible circuit coverfilm adhesion enhancementPALANISWAMY RAVI·Filed 2011·Application pending·0 cites
- 1738US8998384B2Circuits and methods using a non-gold corrosion inhibitorWALSH LYNN·Filed 2011·Granted Apr 7, 2015·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →