Inventor · disambiguated record
Ronald Takao Iwata
Also filed as: IWATA RONALD · IWATA RONALD TAKAO
1 granted patent·6 pending applications·11 citations·filing 2006–2010
33Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0178US7927919B1Semiconductor packaging method to save interposerPOWERTECH TECHNOLOGY INC·Filed 2009·Granted Apr 19, 2011·11 cites·15 claims
- 0239US2008272489A1Package substrate and its solder padPOWERTECH TECHNOLOGY INC·Filed 2007·Application pending·0 cites
- 0337US2007246814A1Ball Grid array package structurePOWERTECH TECHNOLOGY INC·Filed 2006·Application pending·0 cites
- 0436US2009127667A1Semiconductor chip device having through-silicon-via (TSV) and its fabrication methodPOWERTECH TECHNOLOGY INC·Filed 2007·Application pending·0 cites
- 0529US2008088005A1SIP package with small dimensionPOWERTECH TECHNOLOGY INC·Filed 2006·Application pending·0 cites
- 0629US2008087999A1Micro BGA package having multi-chip stackPOWERTECH TECHNOLOGY INC·Filed 2006·Application pending·0 cites
- 0726US2010167534A1Method for fabricating a semiconductor chip device having through-silicon-via (tsv)IWATA RONALD TAKAO·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →