Inventor · disambiguated record

Robert A. Jarvela

Also filed as: JARVELA ROBERT A

2 granted patents·128 citations·filing 1975–1985

69Inventor score

Technology areasH05K H10W

Files withIBM2

Top patents by PatentIndex Score

2 records

0184US4628411AApparatus for directly powering a multi-chip module from a power distribution busIBM·Filed 1985·Granted Dec 9, 1986·73 cites·5 claims
0281US4000509AHigh density air cooled wafer package having improved thermal dissipationIBM·Filed 1975·Granted Dec 28, 1976·55 cites·5 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →