Inventor · disambiguated record
Roman Kris
Also filed as: KRIS ROMAN
19 granted patents·2 pending applications·31 citations·filing 2007–2024
90Inventor score
Files withAPPLIED MATERIALS ISRAEL LTD21
Top patents by PatentIndex Score
21 records- 0194US9530199B1Technique for measuring overlay between layers of a multilayer structureAPPLIED MATERIALS ISRAEL LTD·Filed 2015·Granted Dec 27, 2016·12 cites·15 claims
- 0292US10354376B2Technique for measuring overlay between layers of a multilayer structureAPPLIED MATERIALS ISRAEL LTD·Filed 2018·Granted Jul 16, 2019·5 cites·20 claims
- 0383US9916652B2Technique for measuring overlay between layers of a multilayer structureAPPLIED MATERIALS ISRAEL LTD·Filed 2016·Granted Mar 13, 2018·2 cites·20 claims
- 0479US7973919B2High resolution wafer inspection systemAPPLIED MATERIALS ISRAEL LTD·Filed 2010·Granted Jul 5, 2011·3 cites·4 claims
- 0576US11276160B2Determining a critical dimension variation of a patternAPPLIED MATERIALS ISRAEL LTD·Filed 2018·Granted Mar 15, 2022·2 cites·17 claims
- 0675US9165376B2System, method and computer readable medium for detecting edges of a patternAPPLIED MATERIALS ISRAEL LTD·Filed 2013·Granted Oct 20, 2015·6 cites·20 claims
- 0769US11756188B2Determining a critical dimension variation of a patternAPPLIED MATERIALS ISRAEL LTD·Filed 2022·Granted Sep 12, 2023·0 cites·14 claims
- 0863US11301983B2Measuring height difference in patterns on semiconductor wafersAPPLIED MATERIALS ISRAEL LTD·Filed 2020·Granted Apr 12, 2022·0 cites·20 claims
- 0963US11056404B1Evaluating a hole formed in an intermediate productAPPLIED MATERIALS ISRAEL LTD·Filed 2019·Granted Jul 6, 2021·1 cites·17 claims
- 1056US7714999B2High resolution wafer inspection systemAPPLIED MATERIALS ISRAEL LTD·Filed 2007·Granted May 11, 2010·0 cites·25 claims
- 1156US2025232424A1Determination of undercut sidewalls based on an image of a semiconductor specimenAPPLIED MATERIALS ISRAEL LTD·Filed 2024·Application pending·0 cites
- 1253US10748272B2Measuring height difference in patterns on semiconductor wafersAPPLIED MATERIALS ISRAEL LTD·Filed 2018·Granted Aug 18, 2020·0 cites·20 claims
- 1352US12347734B2Examination of a hole formed in a semiconductor specimenAPPLIED MATERIALS ISRAEL LTD·Filed 2022·Granted Jul 1, 2025·0 cites·21 claims
- 1451US2025225646A1Systems and methods for registration between images informative of one or more semiconductor specimensAPPLIED MATERIALS ISRAEL LTD·Filed 2024·Application pending·0 cites
- 1547US11686571B2Local shape deviation in a semiconductor specimenAPPLIED MATERIALS ISRAEL LTD·Filed 2021·Granted Jun 27, 2023·0 cites·20 claims
- 1647US11455715B2Epitaxy metrology in fin field effect transistorsAPPLIED MATERIALS ISRAEL LTD·Filed 2021·Granted Sep 27, 2022·0 cites·20 claims
- 1744US11651509B2Method, system and computer program product for 3D-NAND CDSEM metrologyAPPLIED MATERIALS ISRAEL LTD·Filed 2019·Granted May 16, 2023·0 cites·11 claims
- 1844US11476081B2Evaluating an intermediate product related to a three-dimensional NAND memory unitAPPLIED MATERIALS ISRAEL LTD·Filed 2020·Granted Oct 18, 2022·0 cites·15 claims
- 1944US11443420B2Generating a metrology recipe usable for examination of a semiconductor specimenAPPLIED MATERIALS ISRAEL LTD·Filed 2020·Granted Sep 13, 2022·0 cites·20 claims
- 2040US10731979B2Method for monitoring nanometric structuresAPPLIED MATERIALS ISRAEL LTD·Filed 2018·Granted Aug 4, 2020·0 cites·19 claims
- 2136US9824852B2CD-SEM technique for wafers fabrication controlAPPLIED MATERIALS ISRAEL LTD·Filed 2015·Granted Nov 21, 2017·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →