Inventor · disambiguated record
Rod C. Langley
Also filed as: LANGLEY ROD C
15 granted patents·1 pending application·348 citations·filing 1989–2004
94Inventor score
Top patents by PatentIndex Score
16 records- 0179US5380401AMethod to remove fluorine residues from bond padsMICRON TECHNOLOGY INC·Filed 1993·Granted Jan 10, 1995·74 cites·10 claims
- 0276US5496773ASemiconductor processing method of providing an electrically conductive interconnecting plug between an elevationally inner electrically conductive node and an elevationally outer electrically conductive nodeMICRON TECHNOLOGY INC·Filed 1995·Granted Mar 5, 1996·42 cites·17 claims
- 0373US5201993AAnisotropic etch methodMICRON TECHNOLOGY INC·Filed 1990·Granted Apr 13, 1993·33 cites·6 claims
- 0472US5169487AAnisotropic etch methodMICRON TECHNOLOGY INC·Filed 1990·Granted Dec 8, 1992·55 cites·31 claims
- 0564US5958801AAnisotropic etch methodMICRON TECHNOLOGY INC·Filed 1996·Granted Sep 28, 1999·19 cites·22 claims
- 0662US4939105APlanarizing contact etchMICRON TECHNOLOGY INC·Filed 1989·Granted Jul 3, 1990·29 cites·15 claims
- 0761US5094900ASelf-aligned sloped contactMICRON TECHNOLOGY INC·Filed 1990·Granted Mar 10, 1992·33 cites·19 claims
- 0857US6686295B2Anisotropic etch methodMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 3, 2004·3 cites·9 claims
- 0957US5817573ASemiconductor processing method of providing an electrically conductive interconnecting plug between an elevationally inner electrically conductive node and an elevationally outer electrically conductive nodeMICRON TECHNOLOGY INC·Filed 1995·Granted Oct 6, 1998·18 cites·18 claims
- 1055US6133156AAnisotropic etch methodMICRON TECHNOLOGY INC·Filed 1997·Granted Oct 17, 2000·11 cites·16 claims
- 1154US5271799AAnisotropic etch methodMICRON TECHNOLOGY INC·Filed 1989·Granted Dec 21, 1993·20 cites·8 claims
- 1253US6461976B1Anisotropic etch methodMICRON TECHNOLOGY INC·Filed 2000·Granted Oct 8, 2002·2 cites·7 claims
- 1344US2005026440A1Anisotropic etch methodFiled 2004·Application pending·0 cites
- 1443US7375036B2Anisotropic etch methodMICRON TECHNOLOGY INC·Filed 2002·Granted May 20, 2008·0 cites·7 claims
- 1540US5960314ASemiconductor processing method of providing an electrically conductive interconnecting plug between an elevationally conductive node and an elevationally outer electrically conductive nodeMICRON TECHNOLOGY INC·Filed 1998·Granted Sep 28, 1999·7 cites·6 claims
- 1621US5385629AAfter etch test method and apparatusMICRON SEMICONDUCTOR INC·Filed 1993·Granted Jan 31, 1995·2 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →