Inventor · disambiguated record
Robert O. Lussow
Also filed as: LUSSOW ROBERT O
14 granted patents·440 citations·filing 1974–1993
94Inventor score
Files withIBM14
Top patents by PatentIndex Score
14 records- 0189US5276964AMethod of manufacturing a high density connector systemIBM·Filed 1993·Granted Jan 11, 1994·70 cites·5 claims
- 0289US4018490AGas discharge display panel fabricationIBM·Filed 1975·Granted Apr 19, 1977·29 cites·19 claims
- 0383US5259110AMethod for forming a multilayer microelectronic wiring moduleIBM·Filed 1992·Granted Nov 9, 1993·65 cites·7 claims
- 0478US5517751AMultilayer microelectronic wiring module and method for forming the sameIBM·Filed 1993·Granted May 21, 1996·50 cites·7 claims
- 0577US4753694AProcess for forming multilayered ceramic substrate having solid metal conductorsIBM·Filed 1986·Granted Jun 28, 1988·49 cites·7 claims
- 0671US4879156AMultilayered ceramic substrate having solid non-porous metal conductorsIBM·Filed 1988·Granted Nov 7, 1989·38 cites·12 claims
- 0767US3961114AGlass compositionIBM·Filed 1974·Granted Jun 1, 1976·11 cites·1 claims
- 0862US4649417AMultiple voltage integrated circuit packaging substrateIBM·Filed 1983·Granted Mar 10, 1987·25 cites·13 claims
- 0960US3939293AMethod for passivating chromiumIBM·Filed 1974·Granted Feb 17, 1976·7 cites·11 claims
- 1059US5401911AVia and pad structure for thermoplastic substrates and method and apparatus for forming the sameIBM·Filed 1992·Granted Mar 28, 1995·30 cites·95 claims
- 1155US5305523AMethod of direct transferring of electrically conductive elements into a substrateIBM·Filed 1992·Granted Apr 26, 1994·25 cites·47 claims
- 1253US5303862ASingle step electrical/mechanical connection process for connecting I/O pins and creating multilayer structuresIBM·Filed 1992·Granted Apr 19, 1994·24 cites·10 claims
- 1351US5205738AHigh density connector systemIBM·Filed 1992·Granted Apr 27, 1993·14 cites·14 claims
- 1431US5397604ANon-contact fluid applicator apparatus and methodIBM·Filed 1993·Granted Mar 14, 1995·3 cites·42 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →