Inventor · disambiguated record
Robert G. Mckenna
Also filed as: MCKENNA ROBERT · MCKENNA ROBERT G
11 granted patents·370 citations·filing 1994–2000
93Inventor score
Files withTEXAS INSTRUMENTS INC11
Top patents by PatentIndex Score
11 records- 0186US6827449B1Adhesive-sealed window lid for micromechanical devicesTEXAS INSTRUMENTS INC·Filed 1998·Granted Dec 7, 2004·30 cites·18 claims
- 0286US5597767ASeparation of wafer into die with wafer-level processingTEXAS INSTRUMENTS INC·Filed 1995·Granted Jan 28, 1997·112 cites·20 claims
- 0386US5516125ABaffled collet for vacuum pick-up of a semiconductor dieTEXAS INSTRUMENTS INC·Filed 1994·Granted May 14, 1996·60 cites·20 claims
- 0484US6471806B1Method of adhering a wafer to wafer tapeTEXAS INSTRUMENTS INC·Filed 2000·Granted Oct 29, 2002·30 cites·10 claims
- 0565US6028351AGasket sealed integrated circuit packageTEXAS INSTRUMENTS INC·Filed 1997·Granted Feb 22, 2000·38 cites·16 claims
- 0663US5482899ALeveling block for semiconductor demounterTEXAS INSTRUMENTS INC·Filed 1994·Granted Jan 9, 1996·27 cites·2 claims
- 0758US6007654ANoncontact method of adhering a wafer to a wafer tapeTEXAS INSTRUMENTS INC·Filed 1997·Granted Dec 28, 1999·22 cites·14 claims
- 0851US6129811AMethod of adhering a wafer to a wafer tapeTEXAS INSTRUMENTS INC·Filed 1998·Granted Oct 10, 2000·15 cites·14 claims
- 0949US6248648B1Method of breaking and separating a wafer into die using a multi-radii domeTEXAS INSTRUMENTS INC·Filed 1999·Granted Jun 19, 2001·15 cites·7 claims
- 1045US6184063B1Method and apparatus for breaking and separating a wafer into die using a multi-radii domeTEXAS INSTRUMENTS INC·Filed 1997·Granted Feb 6, 2001·12 cites·7 claims
- 1136US6685073B1Method and apparatus for stretching and processing saw film tape after breaking a partially sawn waferTEXAS INSTRUMENTS INC·Filed 1997·Granted Feb 3, 2004·9 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →