Inventor · disambiguated record
Robert Montgomery
Also filed as: MONTGOMERY ROBERT · MONTGOMERY ROBERT J · MONTGOMERY ROBERT JAMES
18 granted patents·78 citations·filing 2004–2022
92Inventor score
Top patents by PatentIndex Score
18 records- 0191US7615854B2Semiconductor package that includes stacked semiconductor dieINT RECTIFIER CORP·Filed 2006·Granted Nov 10, 2009·28 cites·12 claims
- 0287US11538744B2Cascode semiconductorNexperia BV·Filed 2021·Granted Dec 27, 2022·2 cites·18 claims
- 0382US7371641B2Method of making a trench MOSFET with deposited oxideINT RECTIFIER CORP·Filed 2005·Granted May 13, 2008·9 cites·6 claims
- 0479US8106446B2Trench MOSFET with deposited oxideMONTGOMERY ROBERT·Filed 2008·Granted Jan 31, 2012·7 cites·16 claims
- 0577US8791525B2Power semiconductor device including a double metal contactMONTGOMERY ROBERT·Filed 2008·Granted Jul 29, 2014·7 cites·12 claims
- 0677US8153464B2Wafer singulation processMONTGOMERY ROBERT·Filed 2006·Granted Apr 10, 2012·6 cites·15 claims
- 0773US7390717B2Trench power MOSFET fabrication using inside/outside spacersINT RECTIFIER CORP·Filed 2005·Granted Jun 24, 2008·6 cites·20 claims
- 0870US7851361B2Laser ablation to selectively thin wafers/die to lower device RDSONINT RECTIFIER CORP·Filed 2006·Granted Dec 14, 2010·3 cites·20 claims
- 0964US12293961B2Method of manufacture for a cascode semiconductor deviceNexperia BV·Filed 2022·Granted May 6, 2025·0 cites·17 claims
- 1064US8173245B2Peelable tape carrierMONTGOMERY ROBERT·Filed 2006·Granted May 8, 2012·2 cites·16 claims
- 1163US9761550B2Power semiconductor device with a double metal contact and related methodINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2016·Granted Sep 12, 2017·1 cites·18 claims
- 1255US9318355B2Power semiconductor device with a double metal contactINT RECTIFIER CORP·Filed 2014·Granted Apr 19, 2016·0 cites·9 claims
- 1354US7368353B2Trench power MOSFET with reduced gate resistanceINT RECTIFIER CORP·Filed 2004·Granted May 6, 2008·7 cites·7 claims
- 1450US11227819B2Cascode semiconductor device and method of manufactureNexperia BV·Filed 2020·Granted Jan 18, 2022·0 cites·18 claims
- 1550US9076779B1Packaging of electronic circuitryBIECK FLORIAN·Filed 2012·Granted Jul 7, 2015·0 cites·18 claims
- 1649US9000512B1Packaging of electronic circuitryBIECK FLORIAN·Filed 2013·Granted Apr 7, 2015·0 cites·23 claims
- 1743US7423317B2Split electrode gate trench power deviceINT RECTIFIER CORP·Filed 2006·Granted Sep 9, 2008·0 cites·12 claims
- 1828US8987898B2Semiconductor wafer with reduced thickness variation and method for fabricating sameBURBIDGE RUPERT·Filed 2011·Granted Mar 24, 2015·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →