Inventor · disambiguated record
Robert Mortan
Also filed as: MORTAN ROBERT · MORTAN ROBERT F
2 granted patents·3 pending applications·134 citations·filing 2003–2024
60Inventor score
Files withTEXAS INSTRUMENTS INC4
Top patents by PatentIndex Score
5 records- 0190US7038311B2Thermally enhanced semiconductor packageTEXAS INSTRUMENTS INC·Filed 2003·Granted May 2, 2006·134 cites·20 claims
- 0248US2025273525A1Sawn individually molded quad flat no-lead (qfn) semiconductor packageTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0342US11600557B2Packaged device having selective lead pullback for dimple depth controlTEXAS INSTRUMENTS INC·Filed 2019·Granted Mar 7, 2023·0 cites·22 claims
- 0432US2005148111A1Method and system for producing resilient solder jointsTEXAS INSTRUMENTS INC·Filed 2003·Application pending·0 cites
- 0531US2004227216A1Flex resistant semiconductor die pad, leadframe, and packageFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →