Inventor · disambiguated record
Ronald A. Norell
Also filed as: NORELL RONALD A · NORELL RONALD ALLEN
16 granted patents·448 citations·filing 1984–2001
95Inventor score
Top patents by PatentIndex Score
16 records- 0186US5839191AVibrating template method of placing solder balls on the I/O pads of an integrated circuit packageUNISYS CORP·Filed 1997·Granted Nov 24, 1998·101 cites·14 claims
- 0276US5561590AHeat transfer sub-assembly incorporating liquid metal surrounded by a seal ringUNISYS CORP·Filed 1995·Granted Oct 1, 1996·52 cites·14 claims
- 0371US4636275AElastic bladder method of fabricating an integrated circuit package having bonding pads in a stepped cavityBURROUGHS CORP·Filed 1986·Granted Jan 13, 1987·39 cites·14 claims
- 0469US5572404AHeat transfer module incorporating liquid metal squeezed from a compliant bodyUNISYS CORP·Filed 1995·Granted Nov 5, 1996·39 cites·14 claims
- 0568US4643935AEpoxy-glass integrated circuit package having bonding pads in a stepped cavityBURROUGHS CORP·Filed 1986·Granted Feb 17, 1987·38 cites·12 claims
- 0661US5303618AVia hole punchNORELL RONALD A·Filed 1992·Granted Apr 19, 1994·34 cites·15 claims
- 0759US5816481APin block method of dispensing solder flux onto the I/O pads of an integrated circuit packageUNISYS CORP·Filed 1997·Granted Oct 6, 1998·27 cites·13 claims
- 0855US6271048B1Process for recycling a substrate from an integrated circuit packageUNISYS CORP·Filed 2000·Granted Aug 7, 2001·13 cites·13 claims
- 0954US5918516AMethod of forming I/O columns with open ends that are free of crater-like voidsUNISYS CORP·Filed 1997·Granted Jul 6, 1999·21 cites·11 claims
- 1054US4519760AMachine for filling via holes in an integrated circuit package with conductive inkBURROUGHS CORP·Filed 1984·Granted May 28, 1985·18 cites·11 claims
- 1150US6581486B1Integrated circuit tester having a fail-safe mechanism for moving IC-chipsUNISYS CORP·Filed 2001·Granted Jun 24, 2003·6 cites·10 claims
- 1248US5454159AMethod of manufacturing I/O terminals on I/O padsUNISYS CORP·Filed 1994·Granted Oct 3, 1995·17 cites·14 claims
- 1347US5087396AMethod of forming holes in unfired ceramic layers of integrated circuit packagesUNISYS CORP·Filed 1991·Granted Feb 11, 1992·19 cites·12 claims
- 1444US6105851AMethod of casting I/O columns on an electronic component with a high yieldUNISYS CORP·Filed 1998·Granted Aug 22, 2000·12 cites·15 claims
- 1538US5724229AElectromechanical assembly having a lid which protects IC chips and holds contact springsUNISYS CORP·Filed 1996·Granted Mar 3, 1998·10 cites·9 claims
- 1629US5075765ALow stress multichip moduleUNISYS·Filed 1990·Granted Dec 24, 1991·2 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →