Inventor · disambiguated record
Roman Ostholt
Also filed as: OSTHOLT ROMAN
21 granted patents·9 pending applications·8 citations·filing 2013–2023
89Inventor score
Files withLPKF LASER & ELECTRONICS AG22LPKF LASER & ELECTRONICS SE6LPKF DISTRIB INC1Plasma Innovations GmbH1
Top patents by PatentIndex Score
30 records- 0181US9924601B2Method for the metallation of a workpiece and a layer structure made up of a workpiece and a metal layerLPKF LASER & ELECTRONICS AG·Filed 2013·Granted Mar 20, 2018·5 cites·14 claims
- 0276US12365051B2Method and device for providing through-openings in a substrate and a substrate produced in said mannerLPKF LASER & ELECTRONICS AG·Filed 2023·Granted Jul 22, 2025·0 cites·21 claims
- 0372US9764978B2Method and device for separating a substrateLPKF LASER & ELECTRONICS AG·Filed 2014·Granted Sep 19, 2017·2 cites·15 claims
- 0464US11618104B2Method and device for providing through-openings in a substrate and a substrate produced in said mannerLPKF LASER & ELECTRONICS AG·Filed 2020·Granted Apr 4, 2023·0 cites·25 claims
- 0561US11401194B2Method and device for separating a substrateLPKF LASER & ELECTRONICS AG·Filed 2017·Granted Aug 2, 2022·0 cites·3 claims
- 0658US11377387B1Method for producing microstructures in a glass substrateLPKF LASER & ELECTRONICS AG·Filed 2020·Granted Jul 5, 2022·0 cites·14 claims
- 0758US10610971B2Method for producing recesses in a substrateLPKF LASER & ELECTRONICS AG·Filed 2014·Granted Apr 7, 2020·0 cites·20 claims
- 0855US10645814B2Method for creating patterned coatings on a molded article, and device for carrying out said methodPlasma Innovations GmbH·Filed 2016·Granted May 5, 2020·1 cites·5 claims
- 0954US11505495B2Method for microstructuring a glass substrate by means of laser radiationLPKF LASER & ELECTRONICS AG·Filed 2020·Granted Nov 22, 2022·0 cites·7 claims
- 1054US11072041B2Method for producing a technical maskLPKF LASER & ELECTRONICS AG·Filed 2018·Granted Jul 27, 2021·0 cites·21 claims
- 1154US2023405726A1Substrate carrier made of glass for processing a substrate and a method for manufacture of the substrate carrierLPKF LASER & ELECTRONICS SE·Filed 2023·Application pending·0 cites
- 1252US11065716B2Method for processing, in particular separating, a substrate by means of laser-induced deep reactive etchingLPKF LASER & ELECTRONICS AG·Filed 2018·Granted Jul 20, 2021·0 cites·12 claims
- 1351US11156774B2Optical component and method for the production thereofLPKF LASER & ELECTRONICS AG·Filed 2018·Granted Oct 26, 2021·0 cites·22 claims
- 1448US11478880B2Method for producing at least one recess in a material by means of electromagnetic radiation and subsequent etching processLPKF LASER & ELECTRONICS AG·Filed 2018·Granted Oct 25, 2022·0 cites·9 claims
- 1548US2016002791A1Method for producing an electrically conductive structure on a non-conductive substrate material, and additive and substrate material intended thereforLPKF LASER & ELECTRONICS AG·Filed 2013·Application pending·0 cites
- 1647US12398066B2Method for producing a display having a carrier substrate, a carrier substrate produced according to said method, and a cover glass intended for a flexible displayLPKF LASER & ELECTRONICS AG·Filed 2020·Granted Aug 26, 2025·0 cites·15 claims
- 1746US11851366B2Site-specific connecting of glass substratesLPKF LASER & ELECTRONICS AG·Filed 2020·Granted Dec 26, 2023·0 cites·14 claims
- 1846US11383972B2Method for producing microstructuresLPKF LASER & ELECTRONICS AG·Filed 2019·Granted Jul 12, 2022·0 cites·16 claims
- 1946US2025011228A1Method for producing a structure for micro-electromechanical systemsLPKF LASER & ELECTRONICS SE·Filed 2022·Application pending·0 cites
- 2045US2023192535A1Method for introducing a recess into a substrateLPKF LASER & ELECTRONICS AG·Filed 2021·Application pending·0 cites
- 2143US12421167B2Substrate made of glass and method for the production thereofLPKF LASER & ELECTRONICS SE·Filed 2021·Granted Sep 23, 2025·0 cites·20 claims
- 2243US12221376B2Method for producing a glass-plastic connectionLPKF LASER & ELECTRONICS AG·Filed 2020·Granted Feb 11, 2025·0 cites·16 claims
- 2343US11515259B2Method and device for the integration of semiconductor wafersLPKF LASER & ELECTRONICS AG·Filed 2018·Granted Nov 29, 2022·0 cites·31 claims
- 2441US11610784B2Method for introducing at least one cutout or aperture into a sheetlike workpieceLPKF LASER & ELECTRONICS AG·Filed 2015·Granted Mar 21, 2023·0 cites·21 claims
- 2540US2023096742A1Mounting method for an integrated semiconductor wafer device, and mounting device able to be used thereforLPKF LASER & ELECTRONICS AG·Filed 2021·Application pending·0 cites
- 2639US2025138305A1Method for machining a workpiece by means of laser radiation in the form of lissajous figures, scanner intended therefor, and mirror elementLPKF LASER & ELECTRONICS SE·Filed 2022·Application pending·0 cites
- 2738US2024414440A1Optical image stabiliser and a mobile device equipped therewithLPKF LASER & ELECTRONICS SE·Filed 2022·Application pending·0 cites
- 2836US2023302741A1Method for producing plastic parts with glass inserts, and plastic parts with glass insertsLPKF LASER & ELECTRONICS SE·Filed 2021·Application pending·0 cites
- 2934US9849692B2Method and apparatus for transferring a printing substance onto a substrate by means of laser radiationLPKF LASER & ELECTRONICS AG·Filed 2017·Granted Dec 26, 2017·0 cites·17 claims
- 3031US2017021450A1Method and device for laser machining a substrate with multiple laser radiation deflectionLPKF DISTRIB INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →