Inventor · disambiguated record
Robert W. Pasco
Also filed as: PASCO ROBERT W · PASCO ROBERT WILLIAM
21 granted patents·2 pending applications·1,278 citations·filing 1983–2007
96Inventor score
Top patents by PatentIndex Score
23 records- 0198US6528145B1Polymer and ceramic composite electronic substratesIBM·Filed 2000·Granted Mar 4, 2003·208 cites·30 claims
- 0298US4954142AMethod of chemical-mechanical polishing an electronic component substrate and polishing slurry thereforIBM·Filed 1989·Granted Sep 4, 1990·330 cites·24 claims
- 0397US6459039B1Method and apparatus to manufacture an electronic package with direct wiring patternIBM·Filed 2000·Granted Oct 1, 2002·125 cites·31 claims
- 0496US5084071AMethod of chemical-mechanical polishing an electronic component substrate and polishing slurry thereforIBM·Filed 1990·Granted Jan 28, 1992·253 cites·22 claims
- 0591US6332782B1Spatial transformation interposer for electronic packagingIBM·Filed 2000·Granted Dec 25, 2001·53 cites·45 claims
- 0690US6319829B1Enhanced interconnection to ceramic substratesIBM·Filed 1999·Granted Nov 20, 2001·79 cites·11 claims
- 0781US5783026AApparatus for stacking sheets by carriersIBM·Filed 1995·Granted Jul 21, 1998·42 cites·11 claims
- 0880US4483629ADynamic testing of electrical conductorsUNIV SYRACUSE·Filed 1983·Granted Nov 20, 1984·33 cites·10 claims
- 0978US5226636AHolding fixture for substratesIBM·Filed 1992·Granted Jul 13, 1993·34 cites·15 claims
- 1070US6509687B1Metal/dielectric laminate with electrodes and process thereofIBM·Filed 1999·Granted Jan 21, 2003·21 cites·43 claims
- 1156US5315749AMethod for holding substratesIBM·Filed 1992·Granted May 31, 1994·15 cites·3 claims
- 1252US5788808AApparatus for forming cavity substrates using compressive padsIBM·Filed 1997·Granted Aug 4, 1998·18 cites·17 claims
- 1350US5746874AApparatus and method for forming cavity substrates using flexible preform insertIBM·Filed 1995·Granted May 5, 1998·17 cites·30 claims
- 1448US6745932B2Low strain chip removal apparatusIBM·Filed 2002·Granted Jun 8, 2004·2 cites·20 claims
- 1547US2009033337A1Temporary chip attach test carrier utilizing an interposerPASCO ROBERT W·Filed 2007·Application pending·0 cites
- 1645US5882455AApparatus and method for forming isotropic multilayer ceramic substratesIBM·Filed 1997·Granted Mar 16, 1999·12 cites·51 claims
- 1744US5759320AMethod of forming cavity substrates using compressive padsIBM·Filed 1997·Granted Jun 2, 1998·12 cites·18 claims
- 1841US6319554B1Method and apparatus for surface metallizationIBM·Filed 1999·Granted Nov 20, 2001·8 cites·22 claims
- 1937US6395337B1Substrate with ceramic coating for camber modification and method for makingIBM·Filed 1999·Granted May 28, 2002·6 cites·21 claims
- 2036US6423174B1Apparatus and insertless method for forming cavity substrates using coated membraneIBM·Filed 1996·Granted Jul 23, 2002·6 cites·25 claims
- 2134US2003104687A1Temporary chip attach structure with thin filmsIBM·Filed 2001·Application pending·0 cites
- 2231US4585672AHydrogen charged thin film conductorUNIV SYRACUSE·Filed 1985·Granted Apr 29, 1986·3 cites·14 claims
- 2329US4525734AHydrogen charged thin film conductorUNIV SYRACUSE·Filed 1983·Granted Jun 25, 1985·1 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →