Inventor · disambiguated record
Roman Perez
Also filed as: PEREZ ROMAN
5 granted patents·4 pending applications·147 citations·filing 2002–2022
82Inventor score
Top patents by PatentIndex Score
9 records- 0193US7456496B2Package design and method of manufacture for chip grid arrayADVANPACK SOLUTIONS PTE LTD·Filed 2005·Granted Nov 25, 2008·48 cites·16 claims
- 0285US6750082B2Method of assembling a package with an exposed die backside with and without a heatsink for flip-chipADVANPACK SOLUTIONS PTE LTD·Filed 2002·Granted Jun 15, 2004·45 cites·58 claims
- 0378US6929981B2Package design and method of manufacture for chip grid arrayADVANPACK SOLUTIONS PTE LTD·Filed 2002·Granted Aug 16, 2005·26 cites·10 claims
- 0477US6734039B2Semiconductor chip grid array package design and method of manufactureADVANPACK SOLUTIONS PTE LTD·Filed 2002·Granted May 11, 2004·28 cites·19 claims
- 0546US2023070388A1Systems and methods for lossless broadband virtual private network accessMASERGY COMMUNICATIONS INC·Filed 2022·Application pending·0 cites
- 0643US10322210B2Preparation method of core-shell structured fibrous scaffoldsUNIV DANKOOK IACF·Filed 2013·Granted Jun 18, 2019·0 cites·8 claims
- 0735US2005087883A1Flip chip package using no-flow underfill and method of fabricationADVANPACK SOLUTIONS PTE LTD·Filed 2003·Application pending·0 cites
- 0834US2004108580A1Leadless semiconductor packaging structure with inverted flip chip and methods of manufactureADVANPACK SOLUTIONS PTE LTD·Filed 2002·Application pending·0 cites
- 0934US2004084508A1Method for constraining the spread of solder during reflow for preplated high wettability lead frame flip chip assemblyADVANPACK SOLUTIONS PTE LTD·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →