Inventor · disambiguated record
Ronald G. Pofahl
Also filed as: POFAHL RONALD G
3 granted patents·291 citations·filing 1998–1999
79Inventor score
Technology areasH10W
Files withGORE ENTERPRISE HOLDINGS INC3
Top patents by PatentIndex Score
3 records- 0193US6015722AMethod for assembling an integrated circuit chip package having an underfill material between a chip and a substrateGORE ENTERPRISE HOLDINGS INC·Filed 1999·Granted Jan 18, 2000·143 cites·2 claims
- 0290US5919329AMethod for assembling an integrated circuit chip package having at least one semiconductor deviceGORE ENTERPRISE HOLDINGS INC·Filed 1998·Granted Jul 6, 1999·102 cites·1 claims
- 0378US5970319AMethod for assembling an integrated circuit chip package having at least one semiconductor deviceGORE ENTERPRISE HOLDINGS INC·Filed 1999·Granted Oct 19, 1999·46 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →