Inventor · disambiguated record

Roger A. Quinn

Also filed as: QUINN ROGER A

1 granted patent·0 citations·filing 2009–2009

14Inventor score

Technology areasH10W

Files withTESSERA INTELLECTUAL PROPERTIE1

Top patents by PatentIndex Score

1 record

0145US7767575B2Forming robust solder interconnect structures by reducing effects of seed layer underetchingTESSERA INTELLECTUAL PROPERTIE·Filed 2009·Granted Aug 3, 2010·0 cites·5 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →