Inventor · disambiguated record
Rosalinda M. Ring
Also filed as: RING ROSALINDA M
47 granted patents·1 pending application·767 citations·filing 1998–2002
98Inventor score
Top patents by PatentIndex Score
48 records- 0197US6549022B1Apparatus and method for analyzing functional failures in integrated circuitsSANDIA CORP·Filed 2000·Granted Apr 15, 2003·187 cites·55 claims
- 0295US6483327B1Quadrant avalanche photodiode time-resolved detectionADVANCED MICRO DEVICES INC·Filed 1999·Granted Nov 19, 2002·123 cites·22 claims
- 0388US6850081B1Semiconductor die analysis via fiber optic communicationADVANCED MICRO DEVICES INC·Filed 2002·Granted Feb 1, 2005·37 cites·7 claims
- 0480US6403388B1Nanomachining method for integrated circuitsADVANCED MICRO DEVICES INC·Filed 2001·Granted Jun 11, 2002·23 cites·20 claims
- 0579US6391664B1Selectively activatable solar cells for integrated circuit analysisADVANCED MICRO DEVICES INC·Filed 1999·Granted May 21, 2002·52 cites·19 claims
- 0670US6500699B1Test fixture for future integrationADVANCED MICRO DEVICES INC·Filed 2000·Granted Dec 31, 2002·14 cites·21 claims
- 0765US6448095B1Circuit access and analysis for a SOI flip-chip dieADVANCED MICRO DEVICES INC·Filed 2001·Granted Sep 10, 2002·9 cites·20 claims
- 0865US6417680B1Method and apparatus for stress testing a semiconductor device using laser-induced circuit excitationADVANCED MICRO DEVICES INC·Filed 1999·Granted Jul 9, 2002·24 cites·20 claims
- 0965US6387715B1Integrated circuit defect detection via laser heat and IR thermographyADVANCED MICRO DEVICES INC·Filed 1999·Granted May 14, 2002·27 cites·20 claims
- 1064US6806198B1Gas-assisted etch with oxygenADVANCED MICRO DEVICES INC·Filed 2001·Granted Oct 19, 2004·9 cites·14 claims
- 1164US6546513B1Data processing device test apparatus and method thereforADVANCED MICRO DEVICES INC·Filed 2000·Granted Apr 8, 2003·11 cites·26 claims
- 1264US6281025B1Substrate removal as a function of SIMS analysisADVANCED MICRO DEVICES INC·Filed 1999·Granted Aug 28, 2001·28 cites·21 claims
- 1361US6372627B1Method and arrangement for characterization of focused-ion-beam insulator depositionADVANCED MICRO DEVICES INC·Filed 1999·Granted Apr 16, 2002·22 cites·35 claims
- 1460US6864972B1IC die analysis via back side lensADVANCED MICRO DEVICES INC·Filed 2002·Granted Mar 8, 2005·2 cites·20 claims
- 1560US6844928B1Fiber optic semiconductor analysis arrangement and method thereforADVANCED MICRO DEVICES INC·Filed 2001·Granted Jan 18, 2005·3 cites·19 claims
- 1659US6565720B1Substrate removal as a function of sputtered ionsADVANCED MICRO DEVICES INC·Filed 2000·Granted May 20, 2003·8 cites·30 claims
- 1757US6621281B1SOI die analysis of circuitry logic states via coupling through the insulatorADVANCED MICRO DEVICES INC·Filed 2001·Granted Sep 16, 2003·7 cites·21 claims
- 1857US6518783B1Circuit construction in back side of die and over a buried insulatorADVANCED MICRO DEVICES INC·Filed 2001·Granted Feb 11, 2003·7 cites·22 claims
- 1957US6414335B1Selective state change analysis of a SOI dieADVANCED MICRO DEVICES INC·Filed 2001·Granted Jul 2, 2002·7 cites·20 claims
- 2056US7062399B1Resistivity analysisADVANCED MICRO DEVICES INC·Filed 2000·Granted Jun 13, 2006·9 cites·23 claims
- 2155US7029595B1Selective etch for uniform metal trace exposure and milling using focused ion beam systemADVANCED MICRO DEVICES INC·Filed 2002·Granted Apr 18, 2006·5 cites·16 claims
- 2253US6700659B1Semiconductor analysis arrangement and method thereforADVANCED MICRO DEVICES INC·Filed 2001·Granted Mar 2, 2004·6 cites·33 claims
- 2353US6686757B1Defect detection in semiconductor devicesADVANCED MICRO DEVICES INC·Filed 1999·Granted Feb 3, 2004·16 cites·16 claims
- 2453US6576484B1IC die analysis via back side circuit construction with heat dissipationADVANCED MICRO DEVICES INC·Filed 2001·Granted Jun 10, 2003·5 cites·20 claims
- 2553US6430728B1Acoustic 3D analysis of circuit structuresADVANCED MICRO DEVICES INC·Filed 1999·Granted Aug 6, 2002·16 cites·22 claims
- 2651US6635572B1Method of substrate silicon removal for integrated circuit devicesADVANCED MICRO DEVICES INC·Filed 2001·Granted Oct 21, 2003·4 cites·20 claims
- 2750US7019511B1Optical analysis of integrated circuitsADVANCED MICRO DEVICES INC·Filed 2001·Granted Mar 28, 2006·4 cites·9 claims
- 2849US6472760B1Nanomachining of integrated circuitsADVANCED MICRO DEVICES INC·Filed 2001·Granted Oct 29, 2002·3 cites·1 claims
- 2949US6303396B1Substrate removal as a function of resistance at the back side of a semiconductor deviceADVANCED MICRO DEVICES INC·Filed 1999·Granted Oct 16, 2001·13 cites·20 claims
- 3048US6635839B1Semiconductor analysis arrangement and method thereforADVANCED MICRO DEVICES INC·Filed 2001·Granted Oct 21, 2003·4 cites·23 claims
- 3147US6870379B1Indirect stimulation of an integrated circuit dieADVANCED MICRO DEVICES INC·Filed 2002·Granted Mar 22, 2005·3 cites·26 claims
- 3246US6281029B1Probe points for heat dissipation during testing of flip chip ICADVANCED MICRO DEVICES INC·Filed 1999·Granted Aug 28, 2001·11 cites·21 claims
- 3346US6277659B1Substrate removal using thermal analysisADVANCED MICRO DEVICES INC·Filed 1999·Granted Aug 21, 2001·11 cites·20 claims
- 3444US6448096B1Atomic force microscopy and signal acquisition via buried insulatorADVANCED MICRO DEVICES INC·Filed 2001·Granted Sep 10, 2002·2 cites·24 claims
- 3539US6248600B1Led in substrate with back side monitoringADVANCED MICRO DEVICES INC·Filed 1999·Granted Jun 19, 2001·6 cites·20 claims
- 3638US6529029B1Magnetic resonance imaging of semiconductor devicesADVANCED MICRO DEVICES INC·Filed 1999·Granted Mar 4, 2003·6 cites·20 claims
- 3737US6421811B1Defect detection via acoustic analysisADVANCED MICRO DEVICES INC·Filed 1999·Granted Jul 16, 2002·4 cites·19 claims
- 3836US6806166B1Substrate removal as a function of emitted photons at the back side of a semiconductor chipADVANCED MICRO DEVICES INC·Filed 1999·Granted Oct 19, 2004·4 cites·19 claims
- 3936US6352871B1Probe grid for integrated circuit excitationADVANCED MICRO DEVICES INC·Filed 1999·Granted Mar 5, 2002·5 cites·30 claims
- 4036US6281028B1LED alignment points for semiconductor dieADVANCED MICRO DEVICES INC·Filed 1999·Granted Aug 28, 2001·5 cites·21 claims
- 4135US6720641B1Semiconductor structure having backside probe points for direct signal access from active and well regionsADVANCED MICRO DEVICES INC·Filed 1998·Granted Apr 13, 2004·5 cites·23 claims
- 4235US6455334B1Probe grid for integrated circuit analysisADVANCED MICRO DEVICES INC·Filed 1999·Granted Sep 24, 2002·4 cites·24 claims
- 4335US6350624B1Substrate removal as a functional of sonic analysisADVANCED MICRO DEVICES INC·Filed 1999·Granted Feb 26, 2002·3 cites·9 claims
- 4435US6277656B1Substrate removal as a function of acoustic analysisFiled 1999·Granted Aug 21, 2001·4 cites·15 claims
- 4535US2002084792A1SOI die analysis of circuitry logic states via coupling through the insulatorADVANCED MICRO DEVICES INC·Filed 2000·Application pending·0 cites
- 4633US6433572B1Intergrated circuit integrity analysis as a function of magnetic field decayADVANCED MICRO DEVICES INC·Filed 1999·Granted Aug 13, 2002·3 cites·15 claims
- 4733US6372529B1Forming elongated probe points useful in testing semiconductor devicesADVANCED MICRO DEVICES INC·Filed 1999·Granted Apr 16, 2002·3 cites·20 claims
- 4833US6300145B1Ion implantation and laser anneal to create n-doped structures in siliconADVANCED MICRO DEVICES INC·Filed 1999·Granted Oct 9, 2001·3 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →