Inventor · disambiguated record
Roslan Bin Said
Also filed as: SAID ROSLAN BIN
10 granted patents·1 pending application·165 citations·filing 2005–2025
90Inventor score
Technology areasH10W
Top patents by PatentIndex Score
11 records- 0197US7557443B2Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devicesMICRON TECHNOLOGY INC·Filed 2005·Granted Jul 7, 2009·66 cites·42 claims
- 0296US7205656B2Stacked device package for peripheral and center device pad layout deviceMICRON TECHNOLOGY INC·Filed 2005·Granted Apr 17, 2007·58 cites·30 claims
- 0393US8823159B2Stacked microelectronic devicesMICRON TECHNOLOGY INC·Filed 2013·Granted Sep 2, 2014·12 cites·19 claims
- 0490US9640458B2Stacked microelectronic devicesMICRON TECHNOLOGY INC·Filed 2014·Granted May 2, 2017·7 cites·14 claims
- 0584US8507318B2Method for manufacturing microelectronic devicesYE SENG KIM DALSON·Filed 2009·Granted Aug 13, 2013·9 cites·21 claims
- 0680US7425463B2Stacked die package for peripheral and center device pad layout deviceMICRON TECHNOLOGY INC·Filed 2006·Granted Sep 16, 2008·7 cites·36 claims
- 0776US7846768B2Stacked die package for peripheral and center device pad layout deviceMICRON TECHNOLOGY INC·Filed 2008·Granted Dec 7, 2010·5 cites·20 claims
- 0874US10431513B2Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devicesMICRON TECHNOLOGY INC·Filed 2017·Granted Oct 1, 2019·1 cites·14 claims
- 0964US11239128B2Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devicesMICRON TECHNOLOGY INC·Filed 2019·Granted Feb 1, 2022·0 cites·20 claims
- 1050US2025336836A1Semiconductor package having auxiliary substrateMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 1143US8269328B2Stacked die package for peripheral and center device pad layout deviceKIM DALSON YE SENG·Filed 2010·Granted Sep 18, 2012·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →