Inventor · disambiguated record
Robert David Sebesta
Also filed as: SEBESTA ROBERT D · SEBESTA ROBERT DAVID
21 granted patents·698 citations·filing 1994–2004
96Inventor score
Files withIBM21
Top patents by PatentIndex Score
21 records- 0195US6373717B1Electronic package with high density interconnect layerIBM·Filed 2000·Granted Apr 16, 2002·97 cites·16 claims
- 0294US6815709B2Structure having flush circuitry features and method of makingIBM·Filed 2001·Granted Nov 9, 2004·126 cites·29 claims
- 0392US6900545B1Variable thickness pads on a substrate surfaceIBM·Filed 2000·Granted May 31, 2005·48 cites·14 claims
- 0490US6351393B1Electronic package for electronic components and method of making sameIBM·Filed 1999·Granted Feb 26, 2002·71 cites·93 claims
- 0585US6829823B2Method of making a multi-layered interconnect structureIBM·Filed 2002·Granted Dec 14, 2004·31 cites·25 claims
- 0684US6538213B1High density design for organic chip carriersIBM·Filed 2000·Granted Mar 25, 2003·40 cites·27 claims
- 0784US6291779B1Fine pitch circuitization with filled plated through holesIBM·Filed 1999·Granted Sep 18, 2001·52 cites·17 claims
- 0877US6429113B1Method for connecting an electrical device to a circuit substrateIBM·Filed 2000·Granted Aug 6, 2002·29 cites·16 claims
- 0976US6618940B2Fine pitch circuitization with filled plated through holesIBM·Filed 2001·Granted Sep 16, 2003·19 cites·13 claims
- 1076US6077766AVariable thickness pads on a substrate surfaceIBM·Filed 1999·Granted Jun 20, 2000·29 cites·13 claims
- 1169US6580494B1Method and system of distortion compensation in a projection imaging expose systemIBM·Filed 2002·Granted Jun 17, 2003·10 cites·18 claims
- 1267US5612573AElectronic package with multilevel connectionsIBM·Filed 1996·Granted Mar 18, 1997·33 cites·14 claims
- 1365US6989297B2Variable thickness pads on a substrate surfaceIBM·Filed 2004·Granted Jan 24, 2006·8 cites·4 claims
- 1463US7024764B2Method of making an electronic packageIBM·Filed 2002·Granted Apr 11, 2006·8 cites·16 claims
- 1560US6013417AProcess for fabricating circuitry on substrates having plated through-holesIBM·Filed 1998·Granted Jan 11, 2000·21 cites·9 claims
- 1658US5712192AProcess for connecting an electrical device to a circuit substrateIBM·Filed 1994·Granted Jan 27, 1998·24 cites·15 claims
- 1757US5505320AMethod employing laser ablating for providing a pattern on a substrateIBM·Filed 1994·Granted Apr 9, 1996·29 cites·17 claims
- 1853US6580491B2Apparatus and method for compensating for distortion of a printed circuit workpiece substrateIBM·Filed 2000·Granted Jun 17, 2003·5 cites·17 claims
- 1944US6014809AMethod for circuitizing over an edge of a circuit cardIBM·Filed 1998·Granted Jan 18, 2000·10 cites·21 claims
- 2040US7098136B2Structure having flush circuit features and method of makingIBM·Filed 2004·Granted Aug 29, 2006·0 cites·17 claims
- 2138US5858254AMultilayered circuitized substrate and method of fabricationIBM·Filed 1997·Granted Jan 12, 1999·8 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →