Inventor · disambiguated record
Ronald Spreitzer
Also filed as: SPREITZER RONALD · SPREITZER RONALD I · SPREITZER RONALD L
5 granted patents·8 pending applications·120 citations·filing 2003–2022
79Inventor score
Top patents by PatentIndex Score
13 records- 0191US7304373B2Power distribution within a folded flex package method and apparatusINTEL CORP·Filed 2004·Granted Dec 4, 2007·83 cites·18 claims
- 0286US7358444B2Folded substrate with interposer package for integrated circuit devicesINTEL CORP·Filed 2004·Granted Apr 15, 2008·34 cites·21 claims
- 0378US12481035B2Silicon photonic systems for LIDAR applicationsINTEL CORP·Filed 2021·Granted Nov 25, 2025·1 cites·25 claims
- 0456US2023318247A1Package with multiple photonic integrated circuit dies optically coupled with each otherINTEL CORP·Filed 2022·Application pending·0 cites
- 0547US7818878B2Integrated circuit device mounting with folded substrate and interposerINTEL CORP·Filed 2008·Granted Oct 26, 2010·0 cites·9 claims
- 0647US2022390562A1Electrical and photonic integrated circuits architectureBAI GUIYUN·Filed 2021·Application pending·0 cites
- 0745US7302756B2Bond finger on via substrate, process of making same, package made thereby, and method of assembling sameINTEL CORP·Filed 2003·Granted Dec 4, 2007·2 cites·10 claims
- 0845US2023207412A1Techniques to enable a flip chip underfill exclusion zoneINTEL CORP·Filed 2021·Application pending·0 cites
- 0937US2006289981A1Packaging logic and memory integrated circuitsNICKERSON ROBERT M·Filed 2005·Application pending·0 cites
- 1035US2005214978A1Lower profile flexible substrate package for electronic componentsTAGGART BRIAN·Filed 2004·Application pending·0 cites
- 1135US2005230850A1Microelectronic assembly having a redistribution conductor over a microelectronic dieTAGGART BRIAN C·Filed 2004·Application pending·0 cites
- 1235US2006001180A1In-line wire bonding on a package, and method of assembling sameTAGGART BRIAN·Filed 2004·Application pending·0 cites
- 1335US2006033217A1Flip-chips on flex substrates, flip-chip and wire-bonded chip stacks, and methods of assembling sameTAGGART BRIAN·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →