Inventor · disambiguated record
Robin A. Susko
Also filed as: SUSKO ROBIN A
20 granted patents·524 citations·filing 1986–2013
96Inventor score
Top patents by PatentIndex Score
20 records- 0197US4885074APlasma reactor having segmented electrodesIBM·Filed 1989·Granted Dec 5, 1989·110 cites·12 claims
- 0293US7709951B2Thermal pillowIBM·Filed 2007·Granted May 4, 2010·27 cites·20 claims
- 0389US6569711B1Methods and apparatus for balancing differences in thermal expansion in electronic packagingIBM·Filed 2000·Granted May 27, 2003·53 cites·7 claims
- 0488US7795724B2Sandwiched organic LGA structureIBM·Filed 2007·Granted Sep 14, 2010·16 cites·12 claims
- 0582US5956235AMethod and apparatus for flexibly connecting electronic devicesIBM·Filed 1998·Granted Sep 21, 1999·67 cites·19 claims
- 0681US7137826B2Temperature dependent semiconductor module connectorsIBM·Filed 2005·Granted Nov 21, 2006·8 cites·14 claims
- 0775US6177728B1Integrated circuit chip device having balanced thermal expansionIBM·Filed 1998·Granted Jan 23, 2001·41 cites·16 claims
- 0871US5189261AElectrical and/or thermal interconnections and methods for obtaining suchIBM·Filed 1990·Granted Feb 23, 1993·52 cites·9 claims
- 0969US5208067ASurface modification of organic materials to improve adhesionIBM·Filed 1991·Granted May 4, 1993·28 cites·14 claims
- 1065US6059579ASemiconductor structure interconnector and assemblyIBM·Filed 1997·Granted May 9, 2000·25 cites·15 claims
- 1164US8674506B2Structures and methods to reduce maximum current density in a solder ballIBM·Filed 2013·Granted Mar 18, 2014·1 cites·13 claims
- 1263US8446006B2Structures and methods to reduce maximum current density in a solder ballBEZAMA RASCHID J·Filed 2009·Granted May 21, 2013·2 cites·22 claims
- 1363US7128579B1Hook interconnectIBM·Filed 2005·Granted Oct 31, 2006·7 cites·20 claims
- 1461US7255571B2Temperature dependent semiconductor module connectorsIBM·Filed 2006·Granted Aug 14, 2007·1 cites·19 claims
- 1561US4654115AProcess for removing contaminantIBM·Filed 1986·Granted Mar 31, 1987·22 cites·11 claims
- 1660US4908094AMethod for laminating organic materials via surface modificationIBM·Filed 1987·Granted Mar 13, 1990·19 cites·11 claims
- 1757US4715941ASurface modification of organic materials to improve adhesionIBM·Filed 1986·Granted Dec 29, 1987·17 cites·18 claims
- 1850US4830706AMethod of making sloped viasIBM·Filed 1986·Granted May 16, 1989·18 cites·6 claims
- 1938US6228246B1Removal of metal skin from a copper-Invar-copper laminateIBM·Filed 1999·Granted May 8, 2001·7 cites·45 claims
- 2033US5039569ASurface modification of organic materials to improve adhesionIBM·Filed 1989·Granted Aug 13, 1991·3 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →