Inventor · disambiguated record
Robert J. Teichmann
Also filed as: TEICHMANN ROBERT J
9 granted patents·230 citations·filing 1981–1997
91Inventor score
Files withPOTTERS INDUSTRIES INC4AVON PROD INC2HOOKER CHEMICALS PLASTICS CORP1OCCIDENTAL CHEM CO1TEICHMANN ROBERT J1
Top patents by PatentIndex Score
9 records- 0185US4711814ANickel particle plating systemTEICHMANN ROBERT J·Filed 1986·Granted Dec 8, 1987·44 cites·9 claims
- 0284US4347107AElectroplating tin and tin alloys and baths thereforHOOKER CHEMICALS PLASTICS CORP·Filed 1981·Granted Aug 31, 1982·25 cites·21 claims
- 0381US5750249AGalvanically compatible conductive filler and methods of making samePOTTERS INDUSTRIES INC·Filed 1993·Granted May 12, 1998·43 cites·50 claims
- 0475US4857233ANickel particle plating systemPOTTERS INDUSTRIES INC·Filed 1988·Granted Aug 15, 1989·34 cites·8 claims
- 0572US5891317AElectroformed hollow jewelryAVON PROD INC·Filed 1997·Granted Apr 6, 1999·28 cites·23 claims
- 0672US5286416AGalvanically compatible conductive filler useful for electromagnetic shielding and corrosion protectionPOTTERS INDUSTRIES INC·Filed 1992·Granted Feb 15, 1994·23 cites·25 claims
- 0767US4381228AProcess and composition for the electrodeposition of tin and tin alloysOCCIDENTAL CHEM CO·Filed 1981·Granted Apr 26, 1983·13 cites·14 claims
- 0850US5175056AGalvanically compatible conductive fillerPOTTERS INDUSTRIES INC·Filed 1990·Granted Dec 29, 1992·11 cites·18 claims
- 0943US5792565AMultiple layered article having a bright copper layerAVON PROD INC·Filed 1996·Granted Aug 11, 1998·9 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →