Inventor · disambiguated record
Robert D. Topa
Also filed as: TOPA ROBERT · TOPA ROBERT D · TOPA ROBERT DAVID
10 granted patents·1 pending application·196 citations·filing 1985–2007
90Inventor score
Top patents by PatentIndex Score
11 records- 0189US5237743AMethod of forming a conductive end portion on a flexible circuit memberIBM·Filed 1992·Granted Aug 24, 1993·69 cites·21 claims
- 0281US6626196B2Arrangement and method for degassing small-high aspect ratio drilled holes prior to wet chemical processingIBM·Filed 2001·Granted Sep 30, 2003·23 cites·17 claims
- 0365US5135155AThermocompression bonding in integrated circuit packagingIBM·Filed 1991·Granted Aug 4, 1992·34 cites·16 claims
- 0460US5006917AThermocompression bonding in integrated circuit packagingIBM·Filed 1989·Granted Apr 9, 1991·25 cites·10 claims
- 0556US4564426AProcess for the deposition of palladium-nickel alloyIBM·Filed 1985·Granted Jan 14, 1986·9 cites·17 claims
- 0642US6179990B1Biased acid cleaning of a copper-invar-copper laminateIBM·Filed 1999·Granted Jan 30, 2001·9 cites·18 claims
- 0742US5242569AThermocompression bonding in integrated circuit packagingIBM·Filed 1991·Granted Sep 7, 1993·12 cites·4 claims
- 0838US6228246B1Removal of metal skin from a copper-Invar-copper laminateIBM·Filed 1999·Granted May 8, 2001·7 cites·45 claims
- 0938US2008241370A1Coating removal from vane rings via tumble stripPRATT & WHITNEY CANADA·Filed 2007·Application pending·0 cites
- 1033US5148261AThermocompression bonding in integrated circuit packagingIBM·Filed 1991·Granted Sep 15, 1992·5 cites·10 claims
- 1131US5120418ALead frame plating apparatus for thermocompression bondingIBM·Filed 1991·Granted Jun 9, 1992·3 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →