Inventor · disambiguated record
Ronald R. Uttecht
Also filed as: UTTECHT RONALD R · UTTECHT RONALD ROBERT
16 granted patents·912 citations·filing 1988–1998
96Inventor score
Files withIBM16
Top patents by PatentIndex Score
16 records- 0198US5883435APersonalization structure for semiconductor devicesIBM·Filed 1996·Granted Mar 16, 1999·316 cites·11 claims
- 0296US5126006APlural level chip maskingIBM·Filed 1991·Granted Jun 30, 1992·133 cites·35 claims
- 0387US5530293ACarbon-free hydrogen silsesquioxane with dielectric constant less than 3.2 annealed in hydrogen for integrated circuitsIBM·Filed 1994·Granted Jun 25, 1996·75 cites·14 claims
- 0480US5420455AArray fuse damage protection devices and fabrication methodIBM·Filed 1994·Granted May 30, 1995·49 cites·5 claims
- 0579US5795819AIntegrated pad and fuse structure for planar copper metallurgyIBM·Filed 1997·Granted Aug 18, 1998·49 cites·2 claims
- 0677US5760674AFusible links with improved interconnect structureIBM·Filed 1995·Granted Jun 2, 1998·45 cites·20 claims
- 0775US4981530APlanarizing ladder-type silsesquioxane polymer insulation layerIBM·Filed 1988·Granted Jan 1, 1991·43 cites·14 claims
- 0872US6093630ASemi-conductor personalization structure and methodIBM·Filed 1998·Granted Jul 25, 2000·36 cites·11 claims
- 0972US5731624AIntegrated pad and fuse structure for planar copper metallurgyIBM·Filed 1996·Granted Mar 24, 1998·37 cites·10 claims
- 1068US5523253AArray protection devices and fabrication methodIBM·Filed 1995·Granted Jun 4, 1996·28 cites·2 claims
- 1167US5545921APersonalized area leadframe coining or half etching for reduced mechanical stress at device edgeIBM·Filed 1994·Granted Aug 13, 1996·34 cites·7 claims
- 1258US5286572APlanarizing ladder-type silsequioxane polymer insulation layerIBM·Filed 1992·Granted Feb 15, 1994·18 cites·15 claims
- 1357US6054339AFusible links formed on interconnects which are at least twice as long as they are deepIBM·Filed 1997·Granted Apr 25, 2000·19 cites·17 claims
- 1451US5723898AArray protection devices and methodIBM·Filed 1996·Granted Mar 3, 1998·14 cites·2 claims
- 1547US5576246APersonalized area leadframe coining or half etching for reduced mechanical stress at device edgeIBM·Filed 1995·Granted Nov 19, 1996·13 cites·8 claims
- 1633US6559046B1Insulator for integrated circuits and processIBM·Filed 1997·Granted May 6, 2003·3 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →