Inventor · disambiguated record
Robbie Villanueva
Also filed as: VILLANUEVA ROBBIE · VILLANUEVA ROBBIE U
2 granted patents·3 pending applications·122 citations·filing 2000–2003
69Inventor score
Files withSKYWORKS SOLUTIONS INC2
Top patents by PatentIndex Score
5 records- 0191US6750546B1Flip-chip leadframe packageSKYWORKS SOLUTIONS INC·Filed 2001·Granted Jun 15, 2004·81 cites·29 claims
- 0282US6787895B1Leadless chip carrier for reduced thermal resistanceSKYWORKS SOLUTIONS INC·Filed 2001·Granted Sep 7, 2004·41 cites·27 claims
- 0333US2002114507A1Saw alignment technique for array device singulationFiled 2001·Application pending·0 cites
- 0433US2004038451A1Method suitable for forming a microelectronic device packageFiled 2003·Application pending·0 cites
- 0527US2002063314A1Tapeless micro-leadframeFiled 2000·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →