Inventor · disambiguated record
Robert H. Wardwell
Also filed as: WARDWELL ROBERT H
9 granted patents·2 pending applications·245 citations·filing 1991–2006
89Inventor score
Top patents by PatentIndex Score
11 records- 0183US5205741AConnector assembly for testing integrated circuit packagesHEWLETT PACKARD CO·Filed 1991·Granted Apr 27, 1993·59 cites·5 claims
- 0280US5923177APortable wedge probe for perusing signals on the pins of an ICHEWLETT PACKARD CO·Filed 1997·Granted Jul 13, 1999·50 cites·5 claims
- 0380US5507652AWedge connector for integrated circuitsHEWLETT PACKARD CO·Filed 1995·Granted Apr 16, 1996·43 cites·3 claims
- 0480US5463324AProbe with contacts that interdigitate with and wedge between adjacent legs of an IC or the likeHEWLETT PACKARD CO·Filed 1993·Granted Oct 31, 1995·54 cites·6 claims
- 0574US6864696B2High density, high frequency, board edge probeAGILENT TECHNOLOGIES INC·Filed 2002·Granted Mar 8, 2005·19 cites·23 claims
- 0650US5701086AConnecting test equipment to adjacent legs of an IC or the like by interdigitating conductive wedges with the legsHEWLETT PACKARD CO·Filed 1993·Granted Dec 23, 1997·14 cites·7 claims
- 0746US6712622B1Connector termination adapterAGILENT TECHNOLOGIES INC·Filed 2002·Granted Mar 30, 2004·5 cites·18 claims
- 0840US7094063B1High density interconnectAGILENT TECHNOLOGIES INC·Filed 2004·Granted Aug 22, 2006·1 cites·16 claims
- 0939US2006281342A1Methods Of Making A InterconnectSELF BOB J·Filed 2006·Application pending·0 cites
- 1035US6776662B2Discrete connector termination adapterAGILENT TECHNOLOGIES INC·Filed 2002·Granted Aug 17, 2004·0 cites·13 claims
- 1133US2004043640A1High density interconnectFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →