Inventor · disambiguated record
Rongfu Wen
Also filed as: WEN RONGFU
3 granted patents·4 pending applications·4 citations·filing 2006–2024
59Inventor score
Files withUNIV COLORADO REGENTS3JIANGSU CHANGJIANG ELECTRONICS2JIANGSU CHANGIANG ELECTRONICS1UNIV HUAZHONG SCIENCE TECH1
Top patents by PatentIndex Score
7 records- 0186US11898807B2Single and multi-layer mesh structures for enhanced thermal transportUNIV COLORADO REGENTS·Filed 2022·Granted Feb 13, 2024·1 cites·6 claims
- 0283US11306983B2Single and multi-layer mesh structures for enhanced thermal transportUNIV COLORADO REGENTS·Filed 2019·Granted Apr 19, 2022·3 cites·20 claims
- 0380US12188732B2Single and multi-layer mesh structures for enhanced thermal transportUNIV COLORADO REGENTS·Filed 2024·Granted Jan 7, 2025·0 cites·7 claims
- 0453US2025091288A13d printing-assisted multi-scale metal three-dimensional surface structure preparation method and productUNIV HUAZHONG SCIENCE TECH·Filed 2023·Application pending·0 cites
- 0541US2008258273A1Package Structure With Flat Bumps For Electronic Device and Method of Manufacture the SameJIANGSU CHANGJIANG ELECTRONICS·Filed 2006·Application pending·0 cites
- 0641US2008315412A1Package Structure with Flat Bumps for Integrate Circuit or Discrete Device and Method of Manufacture the SameJIANGSU CHANGJIANG ELECTRONICS·Filed 2006·Application pending·0 cites
- 0740US2008285251A1Packaging Substrate with Flat Bumps for Electronic Devices and Method of Manufacturing the SameJIANGSU CHANGIANG ELECTRONICS·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →