Inventor · disambiguated record
Ronny Werner
Also filed as: WERNER RONNY
2 granted patents·2 pending applications·0 citations·filing 2017–2022
23Inventor score
Technology areasH10W
Files withSIEMENS AG4
Top patents by PatentIndex Score
4 records- 0153US12482739B2Arrangement for a semiconductor arrangement comprising at least one passive component and a substrateSIEMENS AG·Filed 2022·Granted Nov 25, 2025·0 cites·15 claims
- 0240US2024038630A1Semiconductor module comprising at least one semiconductor elementSIEMENS AG·Filed 2021·Application pending·0 cites
- 0333US10699984B2Semiconductor module with a supporting structure on the bottom sideSIEMENS AG·Filed 2017·Granted Jun 30, 2020·0 cites·9 claims
- 0430US2019214340A1Power moduleSIEMENS AG·Filed 2017·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Ronny Werner files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →