Inventor · disambiguated record
Rodney L. Williamson
Also filed as: WILLIAMSON RODNEY L
9 granted patents·2 pending applications·160 citations·filing 1992–2015
88Inventor score
Top patents by PatentIndex Score
11 records- 0193US6844378B1Method of using triaxial magnetic fields for making particle structuresSANDIA CORP·Filed 2002·Granted Jan 18, 2005·50 cites·11 claims
- 0276US8077754B1Pool power control in remelting systemsWILLIAMSON RODNEY L·Filed 2006·Granted Dec 13, 2011·4 cites·10 claims
- 0368US6115404ADynamic control of remelting processesSANDIA CORP·Filed 1999·Granted Sep 5, 2000·32 cites·10 claims
- 0468US5930284AMultiple input electrode gap controllerSANDIA CORP·Filed 1997·Granted Jul 27, 1999·25 cites·18 claims
- 0566US5373529AMetals purification by improved vacuum arc remeltingSANDIA CORP·Filed 1992·Granted Dec 13, 1994·25 cites·18 claims
- 0655US9220131B1Ingot solidification controller for vacuum arc remeltingWILLIAMSON RODNEY L·Filed 2010·Granted Dec 22, 2015·2 cites·8 claims
- 0755US5708677AArc voltage distribution skewness as an indicator of electrode gap during vacuum arc remeltingSANDIA CORP·Filed 1995·Granted Jan 13, 1998·8 cites·16 claims
- 0853US2012106588A1Pool power-based apparatus to control vacuum arc remelting processesWILLIAMSON RODNEY L·Filed 2011·Application pending·0 cites
- 0947US5621751AControlling electrode gap during vacuum arc remelting at low melting currentSANDIA CORP·Filed 1995·Granted Apr 15, 1997·14 cites·17 claims
- 1041US2014044145A1Integrated metal alloy ingot remelting managerWILLIAMSON RODNEY L·Filed 2012·Application pending·0 cites
- 1137US10422584B2Apparatus to control the total energy flux into the top ingot surface during vacuum arc remelting processesWILLIAMSON RODNEY L·Filed 2015·Granted Sep 24, 2019·0 cites·5 claims
Join the waitlist — get patent alerts
Get an alert when Rodney L. Williamson files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →