Inventor · disambiguated record
Ronghua Xie
Also filed as: XIE RONGHUA
3 granted patents·1 pending application·7 citations·filing 2014–2022
55Inventor score
Files withHUAWEI TECH CO LTD4
Top patents by PatentIndex Score
4 records- 0184US9397632B2FilterHUAWEI TECH CO LTD·Filed 2014·Granted Jul 19, 2016·7 cites·12 claims
- 0247US11756922B2Hybrid bonding structure and hybrid bonding methodHUAWEI TECH CO LTD·Filed 2021·Granted Sep 12, 2023·0 cites·20 claims
- 0346US2022216124A1Heat conductor, heat-conducting material, and package structure of semiconductor deviceHUAWEI TECH CO LTD·Filed 2022·Application pending·0 cites
- 0432US10164731B2Method for base station backhaul, related device and system for base station backhaulHUAWEI TECH CO LTD·Filed 2016·Granted Dec 25, 2018·0 cites·16 claims
Join the waitlist — get patent alerts
Get an alert when Ronghua Xie files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →