Inventor · disambiguated record
Ronnie Yenchik
Also filed as: YENCHIK RONNIE · YENCHIK RONNIE J
8 granted patents·309 citations·filing 2000–2005
88Inventor score
Top patents by PatentIndex Score
8 records- 0198US6482574B1Droplet plate architecture in ink-jet printheadsHEWLETT PACKARD CO·Filed 2000·Granted Nov 19, 2002·140 cites·9 claims
- 0293US6716737B2Method of forming a through-substrate interconnectHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Apr 6, 2004·133 cites·32 claims
- 0375US6682874B2Droplet plate architectureHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Jan 27, 2004·12 cites·8 claims
- 0472US6767474B2Fluid ejector head having a planar passivation layerHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Jul 27, 2004·12 cites·26 claims
- 0566US7262498B2Assembly with a ring and bonding pads formed of a same material on a substrateHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Aug 28, 2007·2 cites·20 claims
- 0661US6837572B2Droplet plate architectureHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Jan 4, 2005·6 cites·6 claims
- 0746US7716823B2Bonding an interconnect to a circuit device and related devicesHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted May 18, 2010·2 cites·52 claims
- 0845US6834942B2Fluid ejector head having a planar passivation layerHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Dec 28, 2004·2 cites·34 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →