Inventor · disambiguated record
Roy Yu
Also filed as: YU ROY · YU ROY R
42 granted patents·1 pending application·1,862 citations·filing 1995–2018
98Inventor score
Top patents by PatentIndex Score
43 records- 0199US6599778B2Chip and wafer integration process using vertical connectionsIBM·Filed 2001·Granted Jul 29, 2003·495 cites·16 claims
- 0298US7354798B2Three-dimensional device fabrication methodIBM·Filed 2002·Granted Apr 8, 2008·285 cites·13 claims
- 0395US7344959B1Metal filled through via structure for providing vertical wafer-to-wafer interconnectionIBM·Filed 2006·Granted Mar 18, 2008·39 cites·19 claims
- 0495US6864165B1Method of fabricating integrated electronic chip with an interconnect deviceIBM·Filed 2003·Granted Mar 8, 2005·83 cites·16 claims
- 0595US6600224B1Thin film attachment to laminate using a dendritic interconnectionIBM·Filed 2000·Granted Jul 29, 2003·83 cites·19 claims
- 0694US8247895B24D device process and structureHAENSCH WILFRIED·Filed 2010·Granted Aug 21, 2012·25 cites·32 claims
- 0794US7564118B2Chip and wafer integration process using vertical connectionsIBM·Filed 2008·Granted Jul 21, 2009·23 cites·18 claims
- 0894US6444560B1Process for making fine pitch connections between devices and structure made by the processIBM·Filed 2000·Granted Sep 3, 2002·65 cites·44 claims
- 0993US7388277B2Chip and wafer integration process using vertical connectionsIBM·Filed 2005·Granted Jun 17, 2008·20 cites·18 claims
- 1093US6036809AProcess for releasing a thin-film structure from a substrateIBM·Filed 1999·Granted Mar 14, 2000·112 cites·15 claims
- 1192US10011098B2Four D device process and structureIBM·Filed 2015·Granted Jul 3, 2018·8 cites·22 claims
- 1291US6640021B2Fabrication of a hybrid integrated circuit device including an optoelectronic chipIBM·Filed 2001·Granted Oct 28, 2003·47 cites·20 claims
- 1389US7566632B1Lock and key structure for three-dimensional chip connection and process thereofIBM·Filed 2008·Granted Jul 28, 2009·19 cites·20 claims
- 1489US7071031B2Three-dimensional integrated CMOS-MEMS device and process for making the sameIBM·Filed 2003·Granted Jul 4, 2006·42 cites·29 claims
- 1588US6737297B2Process for making fine pitch connections between devices and structure made by the processIBM·Filed 2002·Granted May 18, 2004·32 cites·16 claims
- 1687US6856025B2Chip and wafer integration process using vertical connectionsIBM·Filed 2003·Granted Feb 15, 2005·35 cites·4 claims
- 1787US6281452B1Multi-level thin-film electronic packaging structure and related methodIBM·Filed 1998·Granted Aug 28, 2001·53 cites·21 claims
- 1885US7821120B2Metal filled through via structure for providing vertical wafer-to-wafer interconnectionIBM·Filed 2008·Granted Oct 26, 2010·11 cites·16 claims
- 1984US6835589B2Three-dimensional integrated CMOS-MEMS device and process for making the sameIBM·Filed 2002·Granted Dec 28, 2004·48 cites·23 claims
- 2083US7049697B2Process for making fine pitch connections between devices and structure made by the processIBM·Filed 2003·Granted May 23, 2006·22 cites·4 claims
- 2182US6183588B1Process for transferring a thin-film structure to a substrateIBM·Filed 1999·Granted Feb 6, 2001·52 cites·15 claims
- 2281US6090633AMultiple-plane pair thin-film structure and process of manufactureIBM·Filed 1999·Granted Jul 18, 2000·46 cites·15 claims
- 2380US6678949B2Process for forming a multi-level thin-film electronic packaging structureIBM·Filed 2001·Granted Jan 20, 2004·21 cites·8 claims
- 2479US9259902B24D Device, process and structureYU ROY R·Filed 2012·Granted Feb 16, 2016·5 cites·23 claims
- 2579US6998327B2Thin film transfer join process and multilevel thin film moduleIBM·Filed 2002·Granted Feb 14, 2006·27 cites·12 claims
- 2673US5735452ABall grid array by partitioned lamination processIBM·Filed 1996·Granted Apr 7, 1998·38 cites·12 claims
- 2769US6143117AProcess for transferring a thin-film structure to a temporary carrierIBM·Filed 1999·Granted Nov 7, 2000·28 cites·10 claims
- 2866US6099935AApparatus for providing solder interconnections to semiconductor and electronic packaging devicesIBM·Filed 1995·Granted Aug 8, 2000·24 cites·2 claims
- 2960US11458717B2Four D device process and structureIBM·Filed 2018·Granted Oct 4, 2022·0 cites·5 claims
- 3053US6235412B1Corrosion-resistant terminal metal pads for thin film packagesIBM·Filed 2000·Granted May 22, 2001·4 cites·16 claims
- 3153US2016027760A14d device, process and structureIBM·Filed 2015·Application pending·0 cites
- 3247US6455331B2Process of top-surface-metallurgy plate-up bonding and rewiring for multilayer devicesIBM·Filed 2001·Granted Sep 24, 2002·3 cites·3 claims
- 3343US5722579ABottom-surface-metallurgy rework process in ceramic modulesIBM·Filed 1996·Granted Mar 3, 1998·13 cites·22 claims
- 3440US6323045B1Method and structure for top-to-bottom I/O nets repair in a thin film transfer and join processIBM·Filed 1999·Granted Nov 27, 2001·10 cites·16 claims
- 3540US6149048AApparatus and method for use in manufacturing semiconductor devicesIBM·Filed 1998·Granted Nov 21, 2000·7 cites·48 claims
- 3637US6083375AProcess for producing corrosion-resistant terminal metal pads for thin film packagesIBM·Filed 1998·Granted Jul 4, 2000·5 cites·23 claims
- 3736US6448169B1Apparatus and method for use in manufacturing semiconductor devicesIBM·Filed 1995·Granted Sep 10, 2002·5 cites·7 claims
- 3835US6048741ATop-surface-metallurgy plate-up bonding and rewiring for multilayer devicesIBM·Filed 1997·Granted Apr 11, 2000·6 cites·21 claims
- 3935US5937269AGraphics assisted manufacturing process for thin-film devicesIBM·Filed 1997·Granted Aug 10, 1999·6 cites·20 claims
- 4033US6331731B1Column for module componentIBM·Filed 1995·Granted Dec 18, 2001·9 cites·15 claims
- 4130US6248599B1Top-surface-metallurgy plate-up bonding and rewiring for multilayer devicesIBM·Filed 1999·Granted Jun 19, 2001·2 cites·3 claims
- 4230US6054749AThin film device repaired using enhanced repair processIBM·Filed 1999·Granted Apr 25, 2000·2 cites·3 claims
- 4330US5972723AEnhanced thin film wiring net repair processIBM·Filed 1997·Granted Oct 26, 1999·2 cites·29 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →