Inventor · disambiguated record
Ron Zhang
Also filed as: ZHANG RON · ZHANG RON Y · ZHANG RON YIRAN
34 granted patents·18 pending applications·440 citations·filing 1999–2025
97Inventor score
Files withNUBIS COMMUNICATIONS INC15ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC14HEWLETT PACKARD DEVELOPMENT CO7OSHKOSH DEFENSE LLC7SUN MICROSYSTEMS INC3
Top patents by PatentIndex Score
52 records- 0198US12066653B2Communication systems having optical power suppliesNUBIS COMMUNICATIONS INC·Filed 2022·Granted Aug 20, 2024·10 cites·64 claims
- 0298US11046142B2Systems and methods for adapting tractive elements to a disabling eventOSHKOSH DEFENSE LLC·Filed 2020·Granted Jun 29, 2021·46 cites·20 claims
- 0398US10752075B1Systems and methods for determining vehicle characteristicsOSHKOSH DEFENSE LLC·Filed 2018·Granted Aug 25, 2020·124 cites·20 claims
- 0498US10611204B1Systems and methods for adapting tractive elements to a disabling eventOSHKOSH DEFENSE LLC·Filed 2018·Granted Apr 7, 2020·111 cites·20 claims
- 0597US12055766B2Communication systems having co-packaged optical modulesNUBIS COMMUNICATIONS INC·Filed 2023·Granted Aug 6, 2024·20 cites·30 claims
- 0697US12029004B2Data processing systems including optical communication modulesNUBIS COMMUNICATIONS INC·Filed 2021·Granted Jul 2, 2024·17 cites·50 claims
- 0797US12019289B2Communication systems having pluggable modulesNUBIS COMMUNICATIONS INC·Filed 2023·Granted Jun 25, 2024·10 cites·30 claims
- 0897US12004318B2Data processing systems including optical communication modulesNUBIS COMMUNICATIONS INC·Filed 2023·Granted Jun 4, 2024·8 cites·30 claims
- 0996US12250024B2Data processing systems including optical communication modulesNUBIS COMMUNICATIONS INC·Filed 2022·Granted Mar 11, 2025·7 cites·52 claims
- 1094US11982848B2Optical fiber-to-chip interconnectionNUBIS COMMUNICATIONS INC·Filed 2022·Granted May 14, 2024·4 cites·52 claims
- 1191US9991231B2Stacked die integrated circuitINVENSAS CORP·Filed 2016·Granted Jun 5, 2018·7 cites·14 claims
- 1289US12322677B1Fluid channel geometry optimizations to improve cooling efficiencyADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Granted Jun 3, 2025·1 cites·20 claims
- 1385US12490401B2Data processing systems including optical communication modulesNUBIS COMMUNICATIONS INC·Filed 2024·Granted Dec 2, 2025·0 cites·67 claims
- 1485US12461321B2Optical fiber-to-chip interconnectionNUBIS COMMUNICATIONS INC·Filed 2022·Granted Nov 4, 2025·1 cites·56 claims
- 1585US10882373B1High pressure gas spring controls for improved vehicle levelingOSHKOSH DEFENSE LLC·Filed 2018·Granted Jan 5, 2021·5 cites·20 claims
- 1683US9418924B2Stacked die integrated circuitINVENSAS CORP·Filed 2014·Granted Aug 16, 2016·5 cites·19 claims
- 1782US2025147225A1Communication systems having optical power suppliesNUBIS COMMUNICATIONS INC·Filed 2024·Application pending·0 cites
- 1880US12368087B2Embedded cooling systems for advanced device packaging and methods of manufacturing the sameADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Granted Jul 22, 2025·0 cites·20 claims
- 1980US12164142B2Communication systems having optical power suppliesNUBIS COMMUNICATIONS INC·Filed 2023·Granted Dec 10, 2024·0 cites·30 claims
- 2079US12341083B2Electronic device cooling structures bonded to semiconductor elementsADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Jun 24, 2025·0 cites·12 claims
- 2179US12336141B1Cold plate cavity designs for improved thermal performanceADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Granted Jun 17, 2025·0 cites·17 claims
- 2279US12176264B1Manifold designs for embedded liquid cooling in a packageADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Granted Dec 24, 2024·0 cites·20 claims
- 2376US6944025B2EMI shielding apparatusSUN MICROSYSTEMS INC·Filed 2003·Granted Sep 13, 2005·26 cites·17 claims
- 2476US2025309051A1Manifold designs for embedded liquid cooling in a packageADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 2575US2024159979A1Communication systems having pluggable modulesNUBIS COMMUNICATIONS INC·Filed 2024·Application pending·0 cites
- 2674US12412808B1Cold plate and manifold integration for high reliabilityADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Granted Sep 9, 2025·0 cites·19 claims
- 2774US12405433B2Communication systems having pluggable modulesNUBIS COMMUNICATIONS INC·Filed 2022·Granted Sep 2, 2025·0 cites·55 claims
- 2874US2025020877A1Optical fiber-to-chip interconnectionNUBIS COMMUNICATIONS INC·Filed 2024·Application pending·0 cites
- 2974US2025293120A1Electronic device cooling structures bonded to semiconductor elementsADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2025·Application pending·0 cites
- 3072US2025311158A1Cold plate cavity designs for improved thermal performanceADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2025·Application pending·0 cites
- 3171US12455422B2Communication systems having co-packaged optical modulesNUBIS COMMUNICATIONS INC·Filed 2022·Granted Oct 28, 2025·0 cites·54 claims
- 3268US11673444B2Systems and methods for adapting tractive elements to a disabling eventOSHKOSH DEFENSE LLC·Filed 2021·Granted Jun 13, 2023·0 cites·20 claims
- 3367US6243264B1SRAM heat sink assembly and method of assemblingSUN MICROSYSTEMS INC·Filed 1999·Granted Jun 5, 2001·37 cites·18 claims
- 3464US11752824B2High pressure gas spring controls for improved vehicle levelingOSHKOSH DEFENSE LLC·Filed 2021·Granted Sep 12, 2023·0 cites·20 claims
- 3563US2025054837A1Electronic device cooling structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 3663US2025309047A1Liquid and air combo cooling for multi-chip modulesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 3763US2025309045A1Liquid cooling to cpu/mcm bond and package process flowADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 3862US11524543B2Systems and methods for determining vehicle characteristicsOSHKOSH DEFENSE LLC·Filed 2020·Granted Dec 13, 2022·0 cites·20 claims
- 3961US2025253206A1Integrated cooling assemblies for advanced device packaging and methods of manufacturing the sameADEIA SEMICONDUCTOR TECH LLC·Filed 2024·Application pending·0 cites
- 4059US2025096191A1Direct bonding methods and structures for diesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Application pending·0 cites
- 4156US7571059B2Mechanism for determining an accelerated test specification for device elementsSUN MICROSYSTEMS INC·Filed 2006·Granted Aug 4, 2009·1 cites·18 claims
- 4256US2021349272A1Stacked transceiver architectureT&S COMMUNICATIONS CO LTD·Filed 2020·Application pending·0 cites
- 4354US11880564B2Regions with digital ink inputHEWLETT PACKARD DEVELOPMENT CO·Filed 2020·Granted Jan 23, 2024·0 cites·15 claims
- 4454US2019278035A1Stacked transceiver architectureKAIAM CORP·Filed 2019·Application pending·0 cites
- 4553US2025300040A1Fluid channel geometry optimizations to improve cooling efficiencyADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2025·Application pending·0 cites
- 4652US2020386956A1Stacked transceiver architectureT&S COMMUNICATIONS CO LTD·Filed 2019·Application pending·0 cites
- 4748US12108508B2Ambient lighting creation based on a target color temperature rangeHEWLETT PACKARD DEVELOPMENT CO·Filed 2020·Granted Oct 1, 2024·0 cites·17 claims
- 4846US10936147B2Tablet computing device with display dockHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Mar 2, 2021·0 cites·15 claims
- 4946US2023410502A1Virtual reality headset with physical object representationHEWLETT PACKARD DEVELOPMENT CO·Filed 2020·Application pending·0 cites
- 5042US11836298B2Keyboard device to switch between operating system modesHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Dec 5, 2023·0 cites·17 claims
Showing the top 50 of 52 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →