Inventor · disambiguated record
Rongwei Zhang
Also filed as: ZHANG RONGWEI
25 granted patents·12 pending applications·43 citations·filing 2011–2025
93Inventor score
Top patents by PatentIndex Score
37 records- 0191US9305869B1Packaged semiconductor device having leadframe features as pressure valves against delaminationTEXAS INSTRUMENTS INC·Filed 2014·Granted Apr 5, 2016·13 cites·23 claims
- 0289US10083896B1Methods and apparatus for a semiconductor device having bi-material die attach layerTEXAS INSTRUMENTS INC·Filed 2017·Granted Sep 25, 2018·5 cites·16 claims
- 0386US9524926B2Packaged device with additive substrate surface modificationTEXAS INSTRUMENTS INC·Filed 2015·Granted Dec 20, 2016·4 cites·3 claims
- 0486US8912637B1Self-adhesive dieTEXAS INSTRUMENTS INC·Filed 2013·Granted Dec 16, 2014·7 cites·6 claims
- 0585US9214440B1Method for preventing die pad delaminationTEXAS INSTRUMENTS INC·Filed 2014·Granted Dec 15, 2015·6 cites·20 claims
- 0684US9780017B2Packaged device with additive substrate surface modificationTEXAS INSTRUMENTS INC·Filed 2016·Granted Oct 3, 2017·3 cites·20 claims
- 0783US12347742B2IC package with heat spreaderTEXAS INSTRUMENTS INC·Filed 2024·Granted Jul 1, 2025·0 cites·20 claims
- 0882US2025309036A1Ic package with heat spreaderTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 0975US10559524B12-step die attach for reduced pedestal size of laminate component packagesTEXAS INSTRUMENTS INC·Filed 2018·Granted Feb 11, 2020·2 cites·30 claims
- 1075US2025318318A1Integrated filter optical packageTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 1174US10784188B2Methods and apparatus for a semiconductor device having bi-material die attach layerTEXAS INSTRUMENTS INC·Filed 2019·Granted Sep 22, 2020·1 cites·15 claims
- 1272US12009280B2IC package with heat spreaderTEXAS INSTRUMENTS INC·Filed 2021·Granted Jun 11, 2024·0 cites·24 claims
- 1372US10366944B2Methods and apparatus for semiconductor device having bi-material die attach layerTEXAS INSTRUMENTS INC·Filed 2018·Granted Jul 30, 2019·1 cites·15 claims
- 1469US10199348B2Plastic-packaged semiconductor device having wires with polymerized insulating layerTEXAS INSTRUMENTS INC·Filed 2016·Granted Feb 5, 2019·1 cites·16 claims
- 1561US12427602B2Method for realizing high-speed cladding of hollow offset-focus annular laserUNIV SOOCHOW·Filed 2022·Granted Sep 30, 2025·0 cites·10 claims
- 1658US11772193B2Annular hollow offset-focus laser cladding deviceUNIV SOOCHOW·Filed 2022·Granted Oct 3, 2023·0 cites·7 claims
- 1758US2025308971A1Semiconductor die singulation using die attach film and plasma dicingTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 1857US9378984B2Packaging a semiconductor device having wires with polymerized insulator skinTEXAS INSTRUMENTS INC·Filed 2014·Granted Jun 28, 2016·0 cites·8 claims
- 1956US10312212B2Self-adhesive dieTEXAS INSTRUMENTS INC·Filed 2014·Granted Jun 4, 2019·0 cites·18 claims
- 2055US12062596B2Semiconductor die with stepped side surfaceTEXAS INSTRUMENTS INC·Filed 2021·Granted Aug 13, 2024·0 cites·22 claims
- 2154US12364052B2Integrated filter optical packageTEXAS INSTRUMENTS INC·Filed 2019·Granted Jul 15, 2025·0 cites·34 claims
- 2253US10347508B2Printed adhesion deposition to mitigate integrated circuit delaminationTEXAS INSTRUMENTS INC·Filed 2017·Granted Jul 9, 2019·0 cites·13 claims
- 2352US12199008B2Package heat dissipation including a die attach filmTEXAS INSTRUMENTS INC·Filed 2021·Granted Jan 14, 2025·0 cites·11 claims
- 2452US2025210470A1Polymeric die pad for die isolation in chip on lead packageTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 2552US2013277816A1Plastic-packaged semiconductor device having wires with polymerized insulator skinTEXAS INSTRUMENTS INC·Filed 2013·Application pending·0 cites
- 2652US2025079401A1Wafer-level fabrication of electrostatic discharge devicesTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 2751US9490043B2Highly conductive electrically conductive adhesivesZHANG RONGWEI·Filed 2012·Granted Nov 8, 2016·0 cites·19 claims
- 2850US10727085B2Printed adhesion deposition to mitigate integrated circuit package delaminationTEXAS INSTRUMENTS INC·Filed 2015·Granted Jul 28, 2020·0 cites·17 claims
- 2950US9780060B2Packaged IC with solderable sidewallsTEXAS INSTRUMENTS INC·Filed 2016·Granted Oct 3, 2017·0 cites·12 claims
- 3049US9601414B2Method for preventing die pad delaminationTEXAS INSTRUMENTS INC·Filed 2015·Granted Mar 21, 2017·0 cites·19 claims
- 3149US2017365575A1Packaged IC With Solderable SidewallsTEXAS INSTRUMENTS INC·Filed 2017·Application pending·0 cites
- 3246US11018111B2Wafer level derived flip chip packageTEXAS INSTRUMENTS INC·Filed 2019·Granted May 25, 2021·0 cites·20 claims
- 3343US2015069600A1Embedded Silver Nanomaterials into Die Backside to Enhance Package Performance and ReliabilityTEXAS INSTRUMENTS INC·Filed 2013·Application pending·0 cites
- 3443US2023170282A1Non-coplanar or bumped lead frame for electronic isolation deviceTEXAS INSTRUMENTS INC·Filed 2021·Application pending·0 cites
- 3542US2013277825A1Method for Preventing Corrosion of Copper-Aluminum Intermetallic CompoundsTEXAS INSTRUMENTS INC·Filed 2013·Application pending·0 cites
- 3641US2020185322A1Semiconductor device connections with sintered nanoparticlesTEXAS INSTRUMENTS INC·Filed 2018·Application pending·0 cites
- 3740US2014147353A1Compositions and methods for the separation of metalsLIN WEI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →