Inventor · disambiguated record
Rongtian Zhang
Also filed as: ZHANG RONGTIAN
10 granted patents·2 pending applications·53 citations·filing 2010–2024
85Inventor score
Top patents by PatentIndex Score
12 records- 0195US9508607B2Thermal management of tightly integrated semiconductor device, system and/or packageQUALCOMM INC·Filed 2013·Granted Nov 29, 2016·35 cites·51 claims
- 0279US9142548B2FinFET compatible capacitor circuitZHANG RONGTIAN·Filed 2012·Granted Sep 22, 2015·6 cites·11 claims
- 0378US9138191B1Integrated circuit module with lead frame micro-needlesQUALCOMM INC·Filed 2014·Granted Sep 22, 2015·7 cites·10 claims
- 0476US9768161B2FinFET capacitor circuitQUALCOMM INC·Filed 2015·Granted Sep 19, 2017·2 cites·23 claims
- 0576US8952504B2Small form factor magnetic shield for magnetorestrictive random access memory (MRAM)QUALCOMM INC·Filed 2013·Granted Feb 10, 2015·3 cites·67 claims
- 0657US12482510B2Row-hammer condition mitigation using a physically adjacent row mapping tableQUALCOMM INC·Filed 2023·Granted Nov 25, 2025·0 cites·14 claims
- 0757US9276199B2Small form factor magnetic shield for magnetorestrictive random access memory (MRAM)QUALCOMM INC·Filed 2014·Granted Mar 1, 2016·0 cites·47 claims
- 0854US2025383797A1Systems and methods for improved data transferQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0953US9136382B2Native devices having improved device characteristics and methods for fabricationQUALCOMM INC·Filed 2013·Granted Sep 15, 2015·0 cites·12 claims
- 1053US2025391213A1Priority-based data migration for a vehicleQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1151US9202705B1Integrated circuit module with lead frame micro-needlesQUALCOMM INC·Filed 2015·Granted Dec 1, 2015·0 cites·10 claims
- 1241US8541269B2Native devices having improved device characteristics and methods for fabricationEKBOTE SHASHANK S·Filed 2010·Granted Sep 24, 2013·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →