Inventor · disambiguated record
Russell A. Benson
Also filed as: BENSON RUSSELL · BENSON RUSSELL A · BENSON RUSSELL ALLEN
17 granted patents·10 pending applications·109 citations·filing 2006–2025
91Inventor score
Top patents by PatentIndex Score
27 records- 0197US9754946B1Methods of forming an elevationally extending conductor laterally between a pair of conductive linesMICRON TECHNOLOGY INC·Filed 2016·Granted Sep 5, 2017·30 cites·25 claims
- 0292US7648872B2Methods of forming DRAM arraysMICRON TECHNOLOGY INC·Filed 2006·Granted Jan 19, 2010·21 cites·6 claims
- 0391US8614151B2Method of etching a high aspect ratio contactBENSON RUSSELL A·Filed 2008·Granted Dec 24, 2013·22 cites·28 claims
- 0491US7700469B2Methods of forming semiconductor constructionsMICRON TECHNOLOGY INC·Filed 2008·Granted Apr 20, 2010·22 cites·20 claims
- 0589US7919863B2Semiconductor constructionsMICRON TECHNOLOGY INC·Filed 2010·Granted Apr 5, 2011·11 cites·13 claims
- 0688US11563011B2Integrated circuitry, memory circuitry, method used in forming integrated circuitry, and method used in forming memory circuitryMICRON TECHNOLOGY INC·Filed 2020·Granted Jan 24, 2023·2 cites·28 claims
- 0779US11342336B1Integrated circuitry, memory circuitry, method used in forming integrated circuitry, and method used in forming memory circuitryMICRON TECHNOLOGY INC·Filed 2021·Granted May 24, 2022·1 cites·15 claims
- 0873US12052857B2Integrated circuitry, memory circuitry, method used in forming integrated circuitry, and method used in forming memory circuitryMICRON TECHNOLOGY INC·Filed 2022·Granted Jul 30, 2024·0 cites·14 claims
- 0964US12069848B2Sense line and cell contact for semiconductor devicesMICRON TECHNOLOGY INC·Filed 2022·Granted Aug 20, 2024·0 cites·19 claims
- 1063US2024260251A1Memory Circuitry And Methods Used In Forming Memory CircuitryMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1162US2025364015A1Memory Circuitry And Methods Used In Forming Memory CircuitryMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 1259US2024074159A1Sacrificial polysilicon in integration of memory array with peripheryMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 1359US2024074166A1Metal silicide in integration of memory array with peripheryMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 1459US2024074161A1Memory array - periphery integration with split barrier metal stackMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 1559US2024074160A1Integration of memory array with peripheryMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 1658US8030156B2Methods of forming DRAM arraysMICRON TECHNOLOGY INC·Filed 2009·Granted Oct 4, 2011·0 cites·8 claims
- 1758US2024292603A1Damascene digit linesMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 1852US11257766B1Methods of forming microelectronic devices, and related microelectronic devices, memory devices, and electronic systemsMICRON TECHNOLOGY INC·Filed 2020·Granted Feb 22, 2022·0 cites·28 claims
- 1952US11189484B2Semiconductor nitridation passivationMICRON TECHNOLOGY INC·Filed 2019·Granted Nov 30, 2021·0 cites·24 claims
- 2052US2014077126A1Method of etching a high aspect ratio contactMICRON TECHNOLOGY INC·Filed 2013·Application pending·0 cites
- 2151US10134741B2Methods of forming an elevationally extending conductor laterally between a pair of conductive linesMICRON TECHNOLOGY INC·Filed 2017·Granted Nov 20, 2018·0 cites·21 claims
- 2251US2024038588A1Methods of forming the microelectronic devices, and related microelectonic devices and electronic systemsMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 2350US8309413B2Methods of forming capacitorsBENSON RUSSELL A·Filed 2011·Granted Nov 13, 2012·0 cites·8 claims
- 2450US2014252589A1Charge Dissipation of CavitiesMICRON TECHNOLOGY INC·Filed 2014·Application pending·0 cites
- 2548US11011378B2Atom implantation for reduction of compressive stressMICRON TECHNOLOGY INC·Filed 2019·Granted May 18, 2021·0 cites·8 claims
- 2647US11164876B2Atom implantation for passivation of pillar materialMICRON TECHNOLOGY INC·Filed 2019·Granted Nov 2, 2021·0 cites·9 claims
- 2739US9276001B2Semiconductor device and method for manufacturing the sameYANG GUANGJUN·Filed 2012·Granted Mar 1, 2016·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →