Inventor · disambiguated record
Ruby Ann Merto Camenforte
Also filed as: CAMENFORTE RUBY ANN · CAMENFORTE RUBY ANN M · CAMENFORTE RUBY ANN MERTO
5 granted patents·7 pending applications·2 citations·filing 2015–2025
65Inventor score
Files withTEXAS INSTRUMENTS INC12
Top patents by PatentIndex Score
12 records- 0175US2025364381A1Interconnect for ic packageTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 0265US12417965B2Interconnect for IC packageTEXAS INSTRUMENTS INC·Filed 2021·Granted Sep 16, 2025·0 cites·23 claims
- 0361US10964629B2Siderail with mold compound reliefTEXAS INSTRUMENTS INC·Filed 2019·Granted Mar 30, 2021·1 cites·20 claims
- 0455US2025389756A1Hall sensor with multilevel package substrateTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0552US9698085B1Leadframe strip assembly and method of processingTEXAS INSTRUMENTS INC·Filed 2015·Granted Jul 4, 2017·1 cites·10 claims
- 0651US11855027B2Integrated circuits with conductive bumps having a profile with a wave patternTEXAS INSTRUMENTS INC·Filed 2020·Granted Dec 26, 2023·0 cites·14 claims
- 0749US2025079282A1Packages with notched, interdigitated, and retracted metal layersTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 0848US2025006607A1Semiconductor package with retreating metal layersTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 0948US2024404973A1Wafer level process for semiconductor device packageTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 1048US2025111985A1Lead structure for an inductive coilTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 1147US10847483B2Integrated circuits with conductive bumps having a profile with a wave patternTEXAS INSTRUMENTS INC·Filed 2018·Granted Nov 24, 2020·0 cites·15 claims
- 1245US2024063107A1Crack arrest features for miultilevel package substrateTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →