Inventor · disambiguated record
Ruei-Ting Gu
Also filed as: GU RUEI-TING
6 granted patents·23 pending applications·2 citations·filing 2012–2025
65Inventor score
Top patents by PatentIndex Score
29 records- 0161US2025349767A1Semiconductor package structure with improved die pad and method thereofWALTON ADVANCED ENG INC·Filed 2024·Application pending·0 cites
- 0258US2024421137A1Chip package unit, chip package stack module, and method of manufacturing chip package stack moduleWALTON ADVANCED ENG INC·Filed 2024·Application pending·0 cites
- 0358US2024321653A1Wafer package for protection of aluminum die pad of die from damages during probe testing processWALTON ADVANCED ENG INC·Filed 2024·Application pending·0 cites
- 0457US2024266239A1Chip package unit with outer protective layer and method of manufactuirng the sameWALTON ADVANCED ENG INC·Filed 2024·Application pending·0 cites
- 0557US2024260195A1Embedded dual in-line memory moduleWALTON ADVANCED ENG INC·Filed 2024·Application pending·0 cites
- 0656US2024243075A1Chip package with heat dissipation and electromagnetic protectionWALTON ADVANCED ENG INC·Filed 2023·Application pending·0 cites
- 0756US2024162164A1Chip package with metal shielding layer and method of manufacturing the sameWALTON ADVANCED ENG INC·Filed 2023·Application pending·0 cites
- 0855US8448614B1Four-stroke engine without a crankshaft and valvesGU RUEI-TING·Filed 2012·Granted May 28, 2013·2 cites·3 claims
- 0955US2024120300A1Chip packageWALTON ADVANCED ENG INC·Filed 2023·Application pending·0 cites
- 1055US2024088057A1Chip package with electromagnetic interference (emi) shielding layer and ground wire and method of manufacturing the sameWALTON ADVANCED ENG INC·Filed 2023·Application pending·0 cites
- 1155US2024096758A1Chip package having die pad with protective layerWALTON ADVANCED ENG INC·Filed 2023·Application pending·0 cites
- 1255US2024145404A1Chip package with electromagnetic interference shielding layer and method of manufacturing the sameWALTON ADVANCED ENG INC·Filed 2023·Application pending·0 cites
- 1354US12512448B2Multi-layer stacked chip packageWALTON ADVANCED ENG INC·Filed 2023·Granted Dec 30, 2025·0 cites·5 claims
- 1454US12482771B2Chip package with higher bearing capacity in wire bondingWALTON ADVANCED ENG INC·Filed 2023·Granted Nov 25, 2025·0 cites·6 claims
- 1554US11587854B2System in packageWALTON ADVANCED ENG INC·Filed 2021·Granted Feb 21, 2023·0 cites·8 claims
- 1654US2024047375A1Chip package with electromagnetic interference shielding layer and method of manufacturing the sameWALTON ADVANCED ENG INC·Filed 2023·Application pending·0 cites
- 1754US2024063138A1Chip package having four sides provided with electromagnetic interference shielding layers and method of manufacturing the sameWALTON ADVANCED ENG INC·Filed 2023·Application pending·0 cites
- 1854US2025096150A1Anti-electromagnetic interference wafer structureWALTON ADVANCED ENG INC·Filed 2023·Application pending·0 cites
- 1954US2025372562A1Fan-out wafer-level packaging unitWALTON ADVANCED ENG INC·Filed 2025·Application pending·0 cites
- 2054US2025379178A1Module containing fan-out wafer-level packaging (fowlp) unit connected to electronic component by wire bondingWALTON ADVANCED ENG INC·Filed 2025·Application pending·0 cites
- 2154US2023411317A1Chip packageWALTON ADVANCED ENG INC·Filed 2023·Application pending·0 cites
- 2254US2023395537A1Bump of chip package with higher bearing capacity in wire bondingWALTON ADVANCED ENG INC·Filed 2023·Application pending·0 cites
- 2354US2024021552A1Chip package unit, method of manufacturing the same, and package structure formed by stacking the sameWALTON ADVANCED ENG INC·Filed 2023·Application pending·0 cites
- 2454US2025391799A1Fan-out wafer level packaging unitWALTON ADVANCED ENG INC·Filed 2025·Application pending·0 cites
- 2553US11869876B2Thinning system in packageWALTON ADVANCED ENG INC·Filed 2021·Granted Jan 9, 2024·0 cites·10 claims
- 2652US2025349768A1Module containing fan-out wafer-level packaging unit connected to electronic by wire bondingWALTON ADVANCED ENG INC·Filed 2025·Application pending·0 cites
- 2752US2025349783A1Fan-out wafer-level packaging unitWALTON ADVANCED ENG INC·Filed 2025·Application pending·0 cites
- 2849US2023369190A1Integration package with insulating boardsWALTON ADVANCED ENG INC·Filed 2022·Application pending·0 cites
- 2934US9016247B2Four-cylinder four-stroke engine without a crankshaft and valvesGU RUEI-TING·Filed 2013·Granted Apr 28, 2015·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →