Inventor · disambiguated record
Rudolphus H. Hoefs
Also filed as: HOEFS RUDOLPHUS H · HOEFS RUDOLPHUS HENDRIKUS
7 granted patents·1 pending application·7 citations·filing 2019–2025
75Inventor score
Top patents by PatentIndex Score
8 records- 0188US11069555B2Die attach systems, and methods of attaching a die to a substrateASSEMBLEON BV·Filed 2019·Granted Jul 20, 2021·5 cites·11 claims
- 0278US11134595B2Compliant die attach systems having spring-driven bond toolsASSEMBLEON BV·Filed 2019·Granted Sep 28, 2021·2 cites·11 claims
- 0375US12232271B2Component placement systems and methods of operating the sameASSEMBLEON BV·Filed 2023·Granted Feb 18, 2025·0 cites·12 claims
- 0472US2025151250A1Component placement systems and methods of operating the sameASSEMBLEON BV·Filed 2025·Application pending·0 cites
- 0571US11612089B2Component placement systems and methods of operating the sameASSEMBLEON BV·Filed 2021·Granted Mar 21, 2023·0 cites·35 claims
- 0668US11557567B2Methods of attaching die to substrate using compliant die attach system having spring-driven bond toolASSEMBLEON BV·Filed 2021·Granted Jan 17, 2023·0 cites·20 claims
- 0766US11410870B2Die attach systems, and methods of attaching a die to a substrateASSEMBLEON BV·Filed 2021·Granted Aug 9, 2022·0 cites·20 claims
- 0862US12046504B2Positional error compensation in assembly of discrete components by adjustment of optical system characteristicsKULICKE & SOFFA NETHERLANDS B V·Filed 2020·Granted Jul 23, 2024·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →