Inventor · disambiguated record
Ruey-Lian Hwang
Also filed as: HWANG RUEY-LIAN
4 granted patents·114 citations·filing 1997–2000
79Inventor score
Files withTAIWAN SEMICONDUCTOR MFG4
Top patents by PatentIndex Score
4 records- 0187US6306750B1Bonding pad structure to prevent inter-metal dielectric cracking and to improve bondabilityTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Oct 23, 2001·67 cites·17 claims
- 0258US6140603AMicro-cleavage method for specimen preparationTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Oct 31, 2000·24 cites·20 claims
- 0350US6228780B1Non-shrinkable passivation scheme for metal em improvementTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted May 8, 2001·16 cites·16 claims
- 0434US5933704AMethod to reveal the architecture of multilayer interconnectors in integrated circuitsTAIWAN SEMICONDUCTOR MFG·Filed 1997·Granted Aug 3, 1999·7 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →