Inventor · disambiguated record
Rudolf Lehner
Also filed as: LEHNER RUDOLF · LEHNER RUDOLF SIEGFRIED
15 granted patents·4 pending applications·165 citations·filing 2002–2020
91Inventor score
Top patents by PatentIndex Score
19 records- 0192US6867492B2Radio-frequency power component, radio-frequency power module, method for producing a radio-frequency power component, and method for producing a radio-frequency power moduleINFINEON TECHNOLOGIES AG·Filed 2003·Granted Mar 15, 2005·96 cites·10 claims
- 0282US9536816B2Encapsulated electronic chip device with mounting provision and externally accessible electric connection structureINFINEON TECHNOLOGIES AG·Filed 2015·Granted Jan 3, 2017·5 cites·19 claims
- 0381US10307884B2Apparatus for controlling a movement of a grinding wheel, semiconductor wafer grinding system and method for forming semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jun 4, 2019·2 cites·14 claims
- 0479US7417198B2Radiofrequency power semiconductor module with cavity housing, and method for producing itINFINEON TECHNOLOGIES AG·Filed 2003·Granted Aug 26, 2008·29 cites·28 claims
- 0577US6694707B2Apparatus and method for populating transport tapesINFINEON TECHNOLOGIES AG·Filed 2003·Granted Feb 24, 2004·17 cites·24 claims
- 0676US10710210B2Method for forming semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jul 14, 2020·1 cites·20 claims
- 0770US10974365B2Method for processing semiconductor wafers using a grinding wheelINFINEON TECHNOLOGIES AG·Filed 2020·Granted Apr 13, 2021·0 cites·20 claims
- 0864US7259088B2Apparatus for singulating and bonding semiconductor chips, and method for the sameINFINEON TECHNOLOGIES AG·Filed 2005·Granted Aug 21, 2007·3 cites·10 claims
- 0963US11557505B2Method of manufacturing a template waferINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jan 17, 2023·0 cites·19 claims
- 1063US7754009B2Unpolished semiconductor wafer and method for producing an unpolished semiconductor waferSILTRONIC AG·Filed 2006·Granted Jul 13, 2010·2 cites·26 claims
- 1160US7766560B2Connector module and method of manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted Aug 3, 2010·2 cites·44 claims
- 1258US7597484B2MID module and a method of mounting an optical fibre in an MID moduleAVAGO TECH FIBER IP SG PTE LTD·Filed 2007·Granted Oct 6, 2009·2 cites·11 claims
- 1350US6906428B2Electronic component having a semiconductor chip and method for populating a circuit carrier during the production of the electronic componentINFINEON TECHNOLOGIES AG·Filed 2003·Granted Jun 14, 2005·4 cites·25 claims
- 1450US6895731B2Apparatus for populating transport tapesINFINEON TECHNOLOGIES AG·Filed 2003·Granted May 24, 2005·2 cites·20 claims
- 1550US2018047619A1Method of manufacturing a template waferINFINEON TECHNOLOGIES AG·Filed 2017·Application pending·0 cites
- 1645US2006014326A1Method for fabricating a semiconductor component with contacts situated at the undersideINFINEON TECHNOLOGIES AG·Filed 2005·Application pending·0 cites
- 1742US2010237474A1Unpolished Semiconductor Wafer and Method For Producing An Unpolished Semiconductor WaferSILTRONIC AG·Filed 2010·Application pending·0 cites
- 1838US2003015774A1Semiconductor component with contacts situated at the underside, and fabrication methodFiled 2002·Application pending·0 cites
- 1936US7245026B2Configuration and method for contacting circuit structureINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jul 17, 2007·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →