Inventor · disambiguated record
Rutuparna Narulkar
Also filed as: NARULKAR RUTUPARNA
6 granted patents·5 pending applications·49 citations·filing 2017–2025
79Inventor score
Files withMICRON TECHNOLOGY INC11
Top patents by PatentIndex Score
11 records- 0195US11088017B2Stair step structures including insulative materials, and related devicesMICRON TECHNOLOGY INC·Filed 2020·Granted Aug 10, 2021·4 cites·17 claims
- 0295US10269625B1Methods of forming semiconductor structures having stair step structuresMICRON TECHNOLOGY INC·Filed 2017·Granted Apr 23, 2019·39 cites·7 claims
- 0389US10600682B2Semiconductor devices including a stair step structure, and related methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Mar 24, 2020·6 cites·20 claims
- 0474US12279423B2Semiconductor devices comprising carbon-doped silicon nitride and related methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Apr 15, 2025·0 cites·20 claims
- 0573US2025159878A1Methods of forming semiconductor devices comprising carbon-doped silicon nitrideMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0673US2025159877A1Semiconductor devices comprising carbon-doped silicon nitrideMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0771US12205900B2Electronic devices comprising a compressive dielectric material, and related systems and methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Jan 21, 2025·0 cites·20 claims
- 0865US2025157935A1Electronic devices comprising a compressive dielectric materialMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0957US2024071819A1Stress mitigation for three-dimensional metal contactsMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 1054US11282845B2Semiconductor devices comprising carbon-doped silicon nitride and related methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Mar 22, 2022·0 cites·27 claims
- 1149US2024047346A1Memory Circuitry And Method Used In Forming Memory CircuitryMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →