Inventor · disambiguated record
Ruei Ying Sheng
Also filed as: SHENG RUEI YING
2 granted patents·1 pending application·3 citations·filing 2021–2024
46Inventor score
Technology areasH10W
Files withMICRON TECHNOLOGY INC3
Top patents by PatentIndex Score
3 records- 0191US11715696B2Semiconductor devices with recessed pads for die stack interconnectionsMICRON TECHNOLOGY INC·Filed 2021·Granted Aug 1, 2023·3 cites·12 claims
- 0275US12087697B2Semiconductor devices with recessed pads for die stack interconnectionsMICRON TECHNOLOGY INC·Filed 2023·Granted Sep 10, 2024·0 cites·20 claims
- 0375US2024429172A1Semiconductor devices with recessed pads for die stack interconnectionsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →