Inventor · disambiguated record
Ryuichiro Abe
Also filed as: ABE RYUICHIRO
9 granted patents·2 pending applications·60 citations·filing 2005–2023
84Inventor score
Files withDENSO CORP11
Top patents by PatentIndex Score
11 records- 0193US7470996B2Packaging methodDENSO CORP·Filed 2006·Granted Dec 30, 2008·32 cites·5 claims
- 0288US7327004B2Sensor deviceDENSO CORP·Filed 2005·Granted Feb 5, 2008·19 cites·20 claims
- 0377US12487137B2Piezoelectric element, piezoelectric device, and method of manufacturing piezoelectric elementDENSO CORP·Filed 2023·Granted Dec 2, 2025·0 cites·14 claims
- 0462US7373821B2Semiconductor sensor and manufacturing method thereforDENSO CORP·Filed 2006·Granted May 20, 2008·2 cites·27 claims
- 0561US7670918B2Semiconductor device having impurity-doped resistor elementDENSO CORP·Filed 2008·Granted Mar 2, 2010·4 cites·11 claims
- 0654US2023413675A1Piezoelectric film laminated body and manufacturing method of the sameDENSO CORP·Filed 2023·Application pending·0 cites
- 0751US7770452B2Semiconductor sensor and manufacturing method thereforDENSO CORP·Filed 2008·Granted Aug 10, 2010·0 cites·8 claims
- 0851US7615832B2Physical quantity sensor, method for manufacturing the same, and resin film for bonding semiconductor chip and circuit chipDENSO CORP·Filed 2007·Granted Nov 10, 2009·2 cites·10 claims
- 0949US7541574B2Sensor deviceDENSO CORP·Filed 2007·Granted Jun 2, 2009·1 cites·15 claims
- 1041US10901049B2Magnetic sensor and method for manufacturing said magnetic sensorDENSO CORP·Filed 2019·Granted Jan 26, 2021·0 cites·9 claims
- 1138US2007090536A1Sensor having semiconductor chip and circuit chipDENSO CORP·Filed 2006·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Ryuichiro Abe files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →