Inventor · disambiguated record
Ryuji Akebi
Also filed as: AKEBI RYUJI
3 granted patents·2 pending applications·0 citations·filing 2018–2023
40Inventor score
Top patents by PatentIndex Score
5 records- 0158US12324105B2Maleimide resin composition, prepreg, resin film, laminated board, printed wiring board, and semiconductor packageRESONAC CORP·Filed 2021·Granted Jun 3, 2025·0 cites·15 claims
- 0252US12024624B2Maleimide resin composition, prepreg, laminated board, resin film, printed wiring board, and semiconductor packageRESONAC CORP·Filed 2021·Granted Jul 2, 2024·0 cites·13 claims
- 0350US2025188263A1Resin composition, prepreg, laminated board, resin film, printed wiring board, and semiconductor packageRESONAC CORP·Filed 2023·Application pending·0 cites
- 0449US11512214B2Composition containing organic solvents with different vapor pressures, conductor made from composition, method for manufacturing conductor, and structure comprising conductorHITACHI CHEMICAL CO LTD·Filed 2018·Granted Nov 29, 2022·0 cites·17 claims
- 0545US2023391940A1Maleimide resin composition, prepreg, laminate, resin film, printed wiring board, and semiconductor packageRESONAC CORP·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →