Inventor · disambiguated record
Ryota Asai
Also filed as: ASAI RYOTA
8 granted patents·1 pending application·3 citations·filing 2007–2021
74Inventor score
Top patents by PatentIndex Score
9 records- 0183US11553592B2Ceramic substrate and electronic component-embedded moduleMURATA MANUFACTURING CO·Filed 2021·Granted Jan 10, 2023·1 cites·3 claims
- 0279US11246215B2Ceramic substrate and electronic component-embedded moduleMURATA MANUFACTURING CO·Filed 2019·Granted Feb 8, 2022·2 cites·10 claims
- 0365US2022117084A1Ceramic substrate and electronic component-embedded moduleMURATA MANUFACTURING CO·Filed 2021·Application pending·0 cites
- 0463US11258155B2Multilayer electronic componentMURATA MANUFACTURING CO·Filed 2019·Granted Feb 22, 2022·0 cites·19 claims
- 0549US11980980B2Press-fitting method and production method for press-fit productHIRATA SPINNING·Filed 2021·Granted May 14, 2024·0 cites·19 claims
- 0643US11923284B2Wiring substrate and electronic moduleMURATA MANUFACTURING CO·Filed 2019·Granted Mar 5, 2024·0 cites·11 claims
- 0743US11904422B1Press-fitting apparatus, press-fitting jig, and manufacturing apparatusHIRATA SPINNING·Filed 2021·Granted Feb 20, 2024·0 cites·19 claims
- 0843US9814137B2Wiring board and method of manufacturing sameMURATA MANUFACTURING CO·Filed 2016·Granted Nov 7, 2017·0 cites·5 claims
- 0926US8438722B2Apparatus and method for detecting component attachmentUKAI HIDEHIRO·Filed 2007·Granted May 14, 2013·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →