Inventor · disambiguated record
Ryo Awane
Also filed as: AWANE RYO
4 granted patents·4 pending applications·1 citations·filing 2018–2025
60Inventor score
Files withNITTO DENKO CORP8
Top patents by PatentIndex Score
8 records- 0192US11964462B2Electrical debonding adhesive sheet, joined body, and joining and separation method for adherendNITTO DENKO CORP·Filed 2023·Granted Apr 23, 2024·1 cites·1 claims
- 0280US12441083B2Electrical debonding adhesive sheet, joined body, and joining and separation method for adherendNITTO DENKO CORP·Filed 2024·Granted Oct 14, 2025·0 cites·2 claims
- 0377US11623429B2Electrical debonding adhesive sheet, joined body, and joining and separation method for adherendNITTO DENKO CORP·Filed 2019·Granted Apr 11, 2023·0 cites·2 claims
- 0466US2020002581A1Electrically debondable adhesive composition, adhesive sheet, and adhered bodyNITTO DENKO CORP·Filed 2018·Application pending·0 cites
- 0565US2025145870A1Electrically debondable adhesive composition, adhesive sheet, and adhered bodyNITTO DENKO CORP·Filed 2025·Application pending·0 cites
- 0658US12037522B2Electrical debonding type adhesive sheet, joined body, and debonding method for joined bodyNITTO DENKO CORP·Filed 2019·Granted Jul 16, 2024·0 cites·10 claims
- 0754US2022112410A1Separation and bonding method for adherendNITTO DENKO CORP·Filed 2019·Application pending·0 cites
- 0841US2022032600A1Separation method and bonding method for adherendNITTO DENKO CORP·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →