Inventor · disambiguated record
Ryujiro Bando
Also filed as: BANDO RYUJIRO
3 granted patents·1 pending application·15 citations·filing 1996–2024
60Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0169US12431439B2Semiconductor package and semiconductor deviceKIOXIA CORP·Filed 2023·Granted Sep 30, 2025·0 cites·7 claims
- 0259US11837554B2Semiconductor package and semiconductor deviceKIOXIA CORP·Filed 2021·Granted Dec 5, 2023·0 cites·10 claims
- 0354US2024363475A1Semiconductor deviceKIOXIA CORP·Filed 2024·Application pending·0 cites
- 0441US6011220ASemiconductor packaged device and lead frame used thereinTOSHIBA KK·Filed 1996·Granted Jan 4, 2000·15 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →