Inventor · disambiguated record
Ryo Fukasawa
Also filed as: FUKASAWA RYO
26 granted patents·2 pending applications·186 citations·filing 2003–2020
94Inventor score
Files withSHINKO ELECTRIC IND CO17NINTENDO CO LTD6KUWAHARA MASATO2PANASONIC CORP1PANASONIC IP MAN CO LTD1
Top patents by PatentIndex Score
28 records- 0196US7169501B2Fuel cellSHINKO ELECTRIC IND CO·Filed 2003·Granted Jan 30, 2007·105 cites·2 claims
- 0292US8848100B2Information processing device, information processing system, and launch program and storage medium storing the same providing photographing functionalityKUWAHARA MASATO·Filed 2008·Granted Sep 30, 2014·23 cites·20 claims
- 0390US10516280B2Information processing system, information processing device, operation device, and power supply methodNINTENDO CO LTD·Filed 2017·Granted Dec 24, 2019·9 cites·14 claims
- 0488US8917985B2Imaging apparatusKUWAHARA MASATO·Filed 2008·Granted Dec 23, 2014·13 cites·17 claims
- 0585US9630099B2Information processing device, information processing system, and launch program and storage medium storing the same providing photographing functionalityNINTENDO CO LTD·Filed 2014·Granted Apr 25, 2017·5 cites·27 claims
- 0679US10143917B2Operation system, game system, and game controller capable of identifying connected device with simplified schemeNINTENDO CO LTD·Filed 2017·Granted Dec 4, 2018·4 cites·15 claims
- 0778US7030420B2Swing-type display deviceNINTENDO CO LTD·Filed 2003·Granted Apr 18, 2006·17 cites·34 claims
- 0876US9799596B2Wiring substrate and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2017·Granted Oct 24, 2017·3 cites·12 claims
- 0971US9960120B2Wiring substrate with buried substrate having linear conductorsSHINKO ELECTRIC IND CO·Filed 2016·Granted May 1, 2018·2 cites·10 claims
- 1070US9040832B2Wiring substrate and method of manufacturing the sameSHIMIZU YUICHIRO·Filed 2012·Granted May 26, 2015·3 cites·4 claims
- 1166US7648906B2Method and apparatus for processing a conductive thin filmSHINKO ELECTRIC IND CO·Filed 2006·Granted Jan 19, 2010·2 cites·13 claims
- 1258US10644515B2Information processing system, information processing device, operation device, and power supply methodNINTENDO CO LTD·Filed 2019·Granted May 5, 2020·0 cites·21 claims
- 1356US11462501B2Interconnect substrate and method of making the sameSHINKO ELECTRIC IND CO·Filed 2020·Granted Oct 4, 2022·0 cites·10 claims
- 1451US2010316367A1Imaging apparatusNINTENDO CO LTD·Filed 2010·Application pending·0 cites
- 1550US2009169727A1Copper film forming method and manufacturing method of multi-layer wiring substrateSHINKO ELECTRIC IND CO·Filed 2008·Application pending·0 cites
- 1647US9459289B2Probe card and method for manufacturing probe cardSHINKO ELECTRIC IND CO·Filed 2014·Granted Oct 4, 2016·0 cites·10 claims
- 1747US8053877B2Semiconductor packagePANASONIC CORP·Filed 2009·Granted Nov 8, 2011·0 cites·18 claims
- 1846US9488677B2Probe card having a wiring substrateSHINKO ELECTRIC IND CO·Filed 2013·Granted Nov 8, 2016·0 cites·6 claims
- 1946US9373587B2Stacked electronic deviceSHINKO ELECTRIC IND CO·Filed 2014·Granted Jun 21, 2016·0 cites·7 claims
- 2045US9476913B2Probe cardSHINKO ELECTRIC IND CO·Filed 2014·Granted Oct 25, 2016·0 cites·6 claims
- 2145US9470718B2Probe cardSHINKO ELECTRIC IND CO·Filed 2014·Granted Oct 18, 2016·0 cites·5 claims
- 2245US9204544B2Wiring substrate and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2014·Granted Dec 1, 2015·0 cites·4 claims
- 2342US10187979B2Wiring substrate and electronic component deviceSHINKO ELECTRIC IND CO·Filed 2017·Granted Jan 22, 2019·0 cites·12 claims
- 2439US9530725B2Wiring substrate and semiconductor packageSHINKO ELECTRIC IND CO·Filed 2016·Granted Dec 27, 2016·0 cites·5 claims
- 2538US10183633B2Vehicle-mounted-camera bracketPANASONIC IP MAN CO LTD·Filed 2015·Granted Jan 22, 2019·0 cites·8 claims
- 2637US9202781B2Wiring substrate, method for manufacturing wiring substrate, and semiconductor packageSHINKO ELECTRIC IND CO·Filed 2013·Granted Dec 1, 2015·0 cites·11 claims
- 2737US7977569B2Dye sensitized solar cell module and manufacturing method thereofSHINKO ELECTRIC IND CO·Filed 2007·Granted Jul 12, 2011·0 cites·6 claims
- 2835US9721876B2Semiconductor device and method of making the sameSHINKO ELECTRIC IND CO·Filed 2015·Granted Aug 1, 2017·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →